阳极氧化法制备覆氧化铝膜铝基板及其在LED封装中的应用研究

发布时间：2018-05-10 09:55

本文选题：LED封装基板 + 阳极氧化　；参考：《华东师范大学》2015年硕士论文

【摘要】：发光二极管(LED)正逐步取代传统光源,市场对LED功率需求逐渐加大,而传统封装导致LED散热瓶颈,限制了大功率LED发展。LED的热量主要由芯片向下传导,经过封装基板导向热沉,因此封装基板是LED散热通道的重要一环。而目前常用的基板包括金属印刷电路板、覆铜陶瓷板等基板存在散热瓶颈、生产成本过高、存在技术限制等问题。针对该问题本论文致力于研究一种基于阳极氧化技术的高绝缘、高导热、低成本的新型铝基封装基板。研究在硫酸、草酸体系下通过阳极氧化法制备氧化铝(A1203)膜,系统研究了氧化电流密度、溶液浓度、反应时间、电极间距等对氧化铝膜形貌的影响。在0.8mol/L硫酸溶液中,保持两电极间距为3.0cm,进行40min阳极氧化,当电流密度为3.5A/dm2时,制得平均孔径大小为22nm,孔密度为40个/200nm*200nm,膜厚为11μm的氧化铝膜。实验中,采用柔性电极也制得了均匀致密的氧化铝膜。氧化铝膜具有较好的绝缘性,氧化铝最高击穿电压可达2.4kV,并能提高器件的散热能力。为了提高A1203膜在LED封装中反射作用,采用电泳、丝印、提拉等方法在A1203膜表面制备Ti02膜,Ti02膜在保持基板绝缘和散热性能的情况下,提高了基板的表面反射率,有利于其在LED封装中的应用。
[Abstract]:Light emitting diode (LED) is gradually replacing the traditional light source, and the market demand for LED power is increasing gradually, while the traditional packaging leads to the bottleneck of heat dissipation of LED, which limits the heat transfer of high-power LED from the chip down, and the heat sink is guided by the encapsulated substrate. Therefore, the packaging substrate is an important part of the LED heat dissipation channel. However, the commonly used substrates include metal printed circuit boards, copper clad ceramic boards and other substrates, such as heat dissipation bottlenecks, high production costs, technical limitations and so on. In order to solve this problem, a new type of aluminum based packaging substrate based on anodizing technology is studied in this paper, which is characterized by high insulation, high thermal conductivity and low cost. A1203) films were prepared by anodic oxidation in sulfuric acid and oxalic acid systems. The effects of oxidation current density, solution concentration, reaction time and electrode spacing on the morphology of alumina films were systematically studied. In 0.8mol/L sulfuric acid solution, the average pore size, pore density and film thickness of 40min anodic oxidation were 22 nm, 40 / 200 nm and 11 渭 m, respectively, and the average pore size was 22 nm, the pore density was 40 / 200 nm and the thickness of the film was 11 渭 m. In the experiment, a uniform and compact alumina film was also prepared by using flexible electrode. Alumina film has good insulation, the highest breakdown voltage of alumina can be up to 2.4 kV, and the heat dissipation ability of the device can be improved. In order to improve the reflection of A1203 film in LED packaging, the surface reflectivity of the substrate was improved by using electrophoretic, screen printing and Czochralski methods to prepare Ti02 film Ti02 on the surface of A1203 film, while maintaining the insulation and heat dissipation of the substrate. It is beneficial to the application of LED package.
【学位授予单位】：华东师范大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN312.8

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