航天产品中的CCGA装联技术研究

发布时间：2018-05-26 21:20

本文选题：航天产品 + CCGA　；参考：《北华航天工业学院》2017年硕士论文

【摘要】：随着科技的进步和工艺的发展,电子元器件多功能、小型化、高密度、高可靠的发展趋势和要求日益迫切。为适应高可靠应用环境,高密度多引脚面阵列封装BGA由塑料封装转向陶瓷封装。为进一步改善器件基板与电路板之间的热膨胀系数不匹配造成的热疲劳损伤,将BGA封装的焊球换成焊柱,即CCGA封装,具有更高的热可靠性。为满足航天产品的应用需求,论文对CCGA封装器件的高可靠装联技术进行了研究。CCGA装联技术的关键是器件植柱工艺和板级装联工艺。本文通过试验对CCGA装联工艺参数和流程进行摸索和控制,主要包括CCGA植柱工装设计、植柱印刷锡膏量、焊柱安装、印刷参数、贴装参数、回流焊接工艺及温度参数、清洗等。首先,完成不同锡膏量和温度参数下器件板级装联,然后,对试验电路板进行环境试验(温度循环和振动),最后,通过光学显微镜、X-Ray检测仪、金相显微镜、扫描电子显微镜等对焊点外观形貌、焊点内部以及焊料与基板间IMC进行分析。利用有限元仿真对板级PCBA和器件级CCGA在温度循环和振动载荷下应力分布以及变形情况进行了分析,并与环境试验结果进行对比。研究表明:(1)器件植柱工装及工艺可行,植柱效果和板级组装质量达到相关要求。(2)CCGA封装具有更高的热可靠性,可作为苛刻环境中相关电子产品器件的优先选择;研究CCGA封装的组装工艺,为电子产品能在更加苛刻的环境中工作提供可靠的装联工艺。
[Abstract]:With the development of science and technology, the multifunction, miniaturization, high density and high reliability of electronic components are becoming more and more urgent. In order to adapt to the high reliable application environment, the high density multi-pin array packaging (BGA) changed from plastic packaging to ceramic packaging. In order to further improve the thermal fatigue damage caused by the mismatch of thermal expansion coefficient between the substrate and the circuit board, the solder ball of BGA package is replaced by solder post, that is, CCGA package, which has higher thermal reliability. In order to meet the application requirements of aerospace products, the key technologies of high reliability mounting technology of CCGA packaging devices are device mounting technology and plate-level mounting technology. In this paper, the process parameters and process of CCGA mounting are studied and controlled by experiments, including the design of CCGA column mounting equipment, the amount of solder paste, the installation of solder post, printing parameters, mounting parameters, reflux welding process and temperature parameters, cleaning and so on. First of all, to complete the different tin paste and temperature parameters of the device board level assembly, and then, to test the circuit board environment test (temperature cycle and vibration, finally, through optical microscope X-Ray detector, metallographic microscope, Scanning electron microscopy (SEM) was used to analyze the appearance of solder joint, internal solder and IMC between solder and substrate. Finite element simulation was used to analyze the stress distribution and deformation of plate-level PCBA and device-level CCGA under temperature cycling and vibration loading, and the results were compared with the results of environmental tests. The results show that the structure and process of the component are feasible, and the effect of column planting and the quality of board assembly are up to the relevant requirements. The CCGA package has higher thermal reliability and can be used as the first choice of the related electronic devices in harsh environment. The assembly process of CCGA packaging is studied to provide reliable assembly process for electronic products working in more demanding environment.
【学位授予单位】：北华航天工业学院
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TN405

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