基于色彩特征与邻域信息的焊点定位方法

发布时间：2018-05-27 02:34

  本文选题：焊点定位 + 色彩特征　； 参考：《计算机辅助设计与图形学学报》2017年10期

【摘要】：为防止集成电路由于元件相互影响及受到外部干扰而无法正常工作,对高集成度电路板进行绝缘封装必不可少.针对印刷电路板(printed circuit board,PCB)上焊点区域小、数量多、位置密集、形态多样等问题,提出基于色彩特征与邻域信息的多形态焊点定位方法.首先通过建立色彩特征模型,提取PCB的单色色度区间特征与多色色差特征;然后提出了基于色彩特征的多形态焊点定位方法,在完成焊点初定位的基础上,采用窗口扫描法提取像素点的邻域信息,进一步提出基于邻域信息的焊点精确定位优化方法,能够有效地提高PCB焊点区域的定位精度.实验结果表明,该方法能大幅提高焊点区域的填充率及滤除误判像素点,满足对PCB上多形态焊点区域的精确定位需求.
[Abstract]:In order to prevent the integrated circuit from not working properly due to the mutual influence of components and external interference, it is necessary to package the high integrated circuit board with insulation. In order to solve the problems of small solder joint area, large number, dense position and diverse shape on printed circuit boardstick (PCB), a multi-shape solder joint location method based on color features and neighborhood information is proposed. Firstly, the monochromatic interval feature and polychromatic difference feature of PCB are extracted by establishing a color feature model, and then a multi-shape solder joint location method based on color feature is proposed, which is based on the initial location of solder joint. The neighborhood information of pixels is extracted by window scanning method, and the optimization method of solder joint location based on neighborhood information is put forward, which can effectively improve the location accuracy of PCB solder joint area. The experimental results show that this method can greatly improve the filling rate of solder joint area and filter out the misjudged pixel points, and meet the need of accurate location of multi-shape solder joint area on PCB.
【作者单位】： 南京师范大学电气与自动化工程学院;江苏省三维打印装备与制造重点实验室;东南大学仪器科学与工程学院;
【基金】：国家自然科学基金(61601228,51407095,61273243) 江苏省自然科学基金(BK20161021,BK20151548) 江苏省高校自然科学基金(15KJB510016) 江苏省三维打印装备与制造重点实验室项目(BM2013006)资助开放课题(3DL201607)
【分类号】：TN41;TP391.41
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本文编号：1940073