紫外LED的COB封装及其在光固化上的应用

发布时间：2018-05-28 17:29

本文选题：《水俣公约》 + 紫外LED　；参考：《深圳大学》2017年硕士论文

【摘要】：根据《水俣公约》的规定,2020年为止,禁止一定量以上的水银电池及荧光灯的生产与进出口贸易。印刷行业需要用到大量的紫外固化灯,由于传统的高压汞灯不但电耗高,还存在汞污染的危险,必然会退出历史舞台。随着紫外芯片技术的发展,紫外LED的能量转换效率越来越高,单颗紫外LED芯片的光效也已满足要求,紫外LED在高速柔印领域的应用条件日趋成熟,因此,紫外LED固化灯必将成为该领域的主流产品。本文主要针对高速柔印机对紫外LED光源的需求,系统设计制作高能量密度、窄光斑的紫外固化光源,并进行性能测试分析。现在市场上的紫外LED光固化模组主要是利用现有的单颗UV LED或COB直接进行阵列式设计,难以实现高光功率密度和利用率。本文结合目标固化设备,从封装开始进行COB设计,将LED芯片进行阵列排布,通过光学设计和散热技术相结合,并配合后期的二次光学设计,获得了一款高能量密度的紫外LED光源模组,显著提高了光学利用效率和被照射区域的光功率密度,相对市场上现有产品具有更优良的性能。本文采用首尔半导体生产的型号为UV1000-38,385nm的正装垂直紫外芯片,设计并制作打样了COB电路板和石英玻璃透镜,封装制作1并9串和6并9串的两种尺寸的COB样品各一个,利用小尺寸样品进行了近场测试和热阻测试。根据近场测试所获得的光源参数数据,进行6倍阵列以后获得与大尺寸COB大小相同的光源参数数据,通过在光学设计软件LightTools上建模优化,得到了一款硅胶透镜的3D结构模型,并且获得了10cm距离处的紫外能量密度的模拟数值。开软模制作硅胶透镜,将硅胶透镜固定安装在大尺寸COB上,搭建散热平台,使用紫外能量计进行量化测试。测试结果显示:10cm处的实测值与模拟值十分接近。本课题的研究取得了阶段性的成功,为后期完整的印刷光源的搭建奠定了良好的基础,设计的光源模块具有市场推广的实际价值。本课题通过对印刷业的紫外固化灯需求调研和现有紫外芯片性能分析,开展了专业应用于高速柔印机的高功率密度的紫外固化灯的设计研究,并成功设计出样品,通过了测试评估,证明了市场和技术的可行性,对外我国紫外LED发展具有促进作用。
[Abstract]:In accordance with the Minamata Convention, the production, import and export of mercury batteries and fluorescent lamps shall be prohibited by 2020. A large number of UV curing lamps are needed in the printing industry. Because the traditional high pressure mercury lamps are not only high in electricity consumption but also in danger of mercury pollution, they will inevitably withdraw from the stage of history. With the development of ultraviolet chip technology, the energy conversion efficiency of ultraviolet LED becomes higher and higher, and the light efficiency of single ultraviolet LED chip has met the requirements. The application conditions of ultraviolet LED in high speed flexo printing field are becoming more and more mature. UV LED curing lamp will become the mainstream product in this field. Aiming at the demand of high speed flexo printing machine for ultraviolet LED light source, this paper designs and manufactures high energy density and narrow spot UV curing light source, and carries on the performance test and analysis. At present, the UV LED photocuring module in the market is mainly designed by using single UV LED or COB directly, so it is difficult to realize high optical power density and utilization ratio. In this paper, the COB design is carried out from the packaging of the target curing equipment, and the array arrangement of the LED chip is carried out. Through the combination of optical design and heat dissipation technology, and with the secondary optical design of the later stage, A high energy density ultraviolet (LED) light source module is obtained, which improves the optical utilization efficiency and the optical power density of the irradiated area, and has better performance than the existing products in the market. In this paper, we design and fabricate the COB circuit board and quartz glass lens by using the formal vertical ultraviolet chip of UV1000-38385nm, which is produced by Seoul Semiconductor, and package and fabricate one COB sample of 1 and 9 strings and 6 and 9 strings of COB samples, respectively. The near field test and thermal resistance test were carried out with small size samples. According to the light source parameter data obtained from the near field test, the parameters of the light source of the same size as the large size COB are obtained after 6 times array. By modeling and optimizing on the optical design software LightTools, a 3D structure model of the silica gel lens is obtained. The simulation value of ultraviolet energy density at 10cm distance is obtained. The silica gel lens is made by opening the soft mode. The silica gel lens is fixed on the large size COB, the heat dissipation platform is built, and the ultraviolet energy meter is used to carry on the quantitative test. The test results show that the measured value at 10 cm is very close to the simulated value. The research of this subject has made the stage success, has established the good foundation for the later period complete printing light source construction, the design light source module has the actual value which the market popularizes. Based on the research on the demand of UV curing lamp in printing industry and the performance analysis of existing UV chip, the design of high power density UV curing lamp used in high speed flexo printing machine has been carried out, and the sample has been successfully designed. The feasibility of market and technology has been proved by test and evaluation, and the development of UV LED in China has been promoted.
【学位授予单位】：深圳大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TN312.8

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