氧化铝陶瓷基板化学镀铜工艺优化

发布时间：2018-05-29 22:35

本文选题：化学镀铜 + 氧化铝　；参考：《表面技术》2017年04期

【摘要】：目的化学镀铜是氧化铝陶瓷基板金属化的一种重要手段,为了进一步优化氧化铝陶瓷基板化学镀铜工艺,研究了化学镀铜液配比(尤其是镀液中铜离子和甲醛含量)对氧化铝陶瓷覆铜板微结构和导电性的影响。方法在对氧化铝陶瓷基板经过前期处理后,采用化学镀铜法在基板上镀铜。采用X射线衍射仪、光学显微镜对氧化铝基板上的化学镀铜层物相和形貌进行观察。采用覆层测厚仪、四探针测试仪对化学铜镀层的膜厚和方阻进行测量。结果 XRD结果表明,不同配比镀液得到的化学镀铜层均具有较好的晶化程度,镀液中甲醛和铜含量较低的镀液可制备出晶粒更为细小的化学镀铜层。甲醛和铜离子含量均较高时,沉积速度过快,使镀铜层的均匀性和致密性不佳。但当甲醛含量较高、铜离子含量较低时,沉积速度适中,从而获得了均匀性和致密性较好的镀铜层,同时这种镀层具有良好的导电性。结论采用表面活性化学镀铜工艺,当镀液中甲醛浓度为0.25 mol/L和硫酸铜质量浓度为1.2 g/L时,无需高温热处理,即获得了均匀性和致密性俱佳的铜镀层,可满足覆铜板的使用要求。
[Abstract]:Objective electroless copper plating is an important means of metallization of alumina ceramic substrate. In order to further optimize the process of electroless copper plating on alumina ceramic substrate, the influence of the ratio of the electroless copper plating solution (especially the content of copper ion and formaldehyde in the bath) on the microstructure and conductivity of the alumina ceramic coated copper clad plate was studied. After pretreatment, electroless copper plating was used to electroless copper plating on the substrate. The X ray diffractometer was used to observe the phase and morphology of the electroless copper coating on the alumina substrate. The thickness and square resistance of the electroless copper coating were measured by the coating thickness meter and the four probe tester. The results of XRD showed that the plating solution with different proportions was obtained. The obtained electroless copper plating layer has better crystallization degree. The plating solution with low formaldehyde and copper content in the plating bath can produce a more fine electroless copper plating layer. When the content of formaldehyde and copper ions is high, the deposition rate is too fast and the uniformity and densification of the copper plating layer is not good. The deposition rate is moderate, and the copper coating with good uniformity and compactness is obtained. At the same time, the coating has good conductivity. Conclusion using surface active chemical copper plating process, when the concentration of formaldehyde is 0.25 mol/L and the mass concentration of copper sulphate is 1.2 g/L in the plating bath, no high temperature heat treatment is needed, that is, copper with good uniformity and compactness is obtained. The coating can meet the requirements for the use of copper clad plate.
【作者单位】：重庆科技学院冶金与材料工程学院;重庆鸿富诚电子新材料有限公司;
【基金】：重庆高校创新团队建设计划资助项目(CXTDX201601032)~~
【分类号】：TN405

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