数字图像相关用于印刷电路板全场微应变的测量

发布时间：2018-05-31 01:28

本文选题：数字图像相关 + 印刷电路板　；参考：《红外与激光工程》2017年11期

【摘要】：提出了利用数字图像相关技术测量印刷电路板全场微应变的方法,用于评估电路板由应力所导致的失效风险,克服传统实验测试方法不能有效测量全场应变以及难以给出应变集中区域的不足。设计了基于三维数字图像相关技术和应力加载策略的实验方法,通过所获得的全场主应变分布及局部区域内应变历史曲线来评估电路板的失效风险。实验结果表明,所提出的电路板微应变测量方法的重复性优于100με,能够有效地获得电路板全场的微应变分布,尤其是能够直观地显示电路板应变超过额定值的区域分布,为改进电路板设计、降低电路板失效风险和保护电子元器件的安全提供了重要的实测数据。
[Abstract]:In this paper, a digital image correlation technique is proposed to measure the full field strain of printed circuit board, which is used to evaluate the failure risk caused by the stress of the printed circuit board. It overcomes the shortcoming that the traditional test method can not measure the full field strain effectively and it is difficult to give the strain concentration region. An experimental method based on 3D digital image correlation technique and stress loading strategy is designed to evaluate the failure risk of the circuit board through the obtained full-field principal strain distribution and the strain history curve in the local region. The experimental results show that the repeatability of the proposed microstrain measurement method is better than 100 渭蔚, and the microstrain distribution of the circuit board can be obtained effectively, especially the regional distribution of the circuit board strain exceeding the rated value. It provides important measured data for improving the circuit board design, reducing the risk of circuit board failure and protecting the safety of electronic components.
【作者单位】：北京信息科技大学仪器科学与光电工程学院;诺基亚通信系统技术(北京)有限公司;奥克兰大学机械工程系;
【基金】：国家自然科学基金(51675055,11672045,51705025) 北京信息科技大学“勤信人才”培育计划
【分类号】：TN41

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