LTCC无源器件设计建模研究

发布时间：2018-06-12 02:49

  本文选题：LTCC + 微波无源器件　； 参考：《电子科技大学》2015年硕士论文

【摘要】：高密度多层基板是实现多芯片组件MCM(Multichip Module)的关键。低温共烧陶瓷LTCC(Low Temperature Co-fired Ceramic)由于其独特的优势,成为了高速高密度集成封装技术研究的热点。目前,国内多家单位已具有LTCC微波频段的成熟工艺线,但是对LTCC建模建库和设计平台建设的研究相对落后,并严重制约了LTCC产品的快速开发和设计能力。本文的主要工作是微波LTCC设计平台,建模建库项目的部分工作,主要针对常用微波无源器件和缝隙耦合结构进行,并做了一部分小型化设计的工作。主要研究内容如下:1.LTCC多层电路常用结构分析。介绍了常用的传输线结构并给出设计解析和经验公式,对LTCC层间和同层互联过渡结构进行了仿真优化。2.LTCC微波无源器件建模。分析微波电路特别是三端口和四端口网络的工作特点和指标特性,并基于解析、经验公式以及仿真优化的手段建立设计指标和物理尺寸间映射关系,建立了耦合线定向耦合器、分支线耦合器、wilkinson功分器、环形电桥和Marchand巴伦的仿真模型。3.LTCC微波无源器件小型化设计。对层间互联通孔的等效传输线特性,主要是等效特性阻抗和等效电长度进行仿真分析;结合LTCC多层电路技术的优势,利用枝节加载法对λg/4传输线进行小型化改进,验证该小型化技术的可行性;最后针对耦合线定向耦合器、分支线电桥和环形电桥进行了小型化设计,达到了良好的效果。4.投版加工并测试,对比仿真模型,验证无源器件模型有效性,分析了小型化器件的性能,并依据测试结果对存在的问题进行了分析,提出了改进思路。
[Abstract]:High density multilayer substrate is the key to realize MCM-multichip module. LTCC low temperature Co-fired Ceramic-based ceramic has become a hotspot in high speed and high density integrated packaging technology due to its unique advantages. At present, many units in our country already have the mature process line of LTCC microwave frequency band, but the research on LTCC modeling and building database and design platform is relatively backward, which seriously restricts the rapid development and design ability of LTCC products. The main work of this paper is the microwave LTCC design platform, modeling part of the database project, mainly for the common microwave passive devices and slot coupling structure, and do a part of the miniaturization design work. The main research contents are as follows: 1. Structure analysis of LTCC multilayer circuit. The commonly used transmission line structures are introduced, and the design analysis and empirical formulas are given. The simulation and optimization of LTCC interlayer and colayer interconnection transition structures are carried out. 2. LTCC microwave passive devices are modeled. This paper analyzes the working characteristics and index characteristics of microwave circuits, especially three-port and four-port networks, and establishes the mapping relationship between design indexes and physical dimensions based on analytical, empirical formulas and simulation optimization methods, and establishes the coupled line directional coupler. The simulation model of branch line coupler Wilkinson power divider ring bridge and Marchand Barron. 3. The miniaturization design of LTCC microwave passive devices. The characteristics of equivalent transmission line of interlayer interconnect holes are simulated and analyzed, which are mainly equivalent characteristic impedance and equivalent electric length, combined with the advantage of LTCC multilayer circuit technology, the 位 g / 4 transmission line is miniaturized by the branch loading method. Finally, the miniaturization design of coupling wire directional coupler, branch line bridge and annular bridge has been carried out, and good results have been achieved. 4. Compared with the simulation model, the validity of the passive device model is verified, the performance of the miniaturized device is analyzed, the existing problems are analyzed according to the test results, and the improvement ideas are put forward.
【学位授予单位】：电子科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN62
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本文编号：2007953