纸基全印制导电线路制备技术及器件应用研究

发布时间：2018-06-26 02:47

本文选题：纸基 + 喷墨印制　；参考：《电子科技大学》2017年硕士论文

【摘要】：近年来,随着电子产品向低成本、柔性化的方向发展,传统的刚性电路板已经不能满足当前电子器件发展需求。纸基电路成本低、可降解、能够折叠成三维器件,对柔性电子的发展具有十分重要的意义。本论文将探讨纸基全印制导电线路的制备技术,为纸基柔性印刷电路的制备提供可行性解决方案。本论文采用喷印催化油墨与化学沉积金属层相结合的方式在纸基表面制备导电线路,针对溶液型催化油墨在多孔纸基表面渗透率过高,导致催化化学沉积速度慢,金属膜层覆盖不完整等问题,采用适用于纸基表面前处理的氯化亚锡胶体溶液,在纸基表面形成一层胶体薄膜,将油墨的渗透深度从约330μm降低到100μm,使得金属膜层既能生长到纸基纤维内部,增强金属膜层的附着性能,又能在纸基表面留存足够多的催化油墨,改善沉积金属膜层的质量。优化化学沉积时间,完善工艺流程,在无需任何严苛环境要求和精密设备仪器的情况下,使用本论文所研究技术途径在纸基上制备出致密、平整、连续的导电铜层。铜层的电导率达到铜块材的70%,且制备出的线条图案精度也达到约95μm。通过对纸基全印制导电线路弯折弯曲性能的研究,得出无论是弯折还是弯曲,纸基全印制导电线路都会保持一定的导电性。并且,利用纸基全印制导电线路的弯折弯曲性能,本论文还制作出了三维折叠器件原型,显示出该技术路线的潜在应用价值。依据设计理论与基本天线结构,在厚度为356μm,相对介电常数为2.16,损耗角正切值为0.0012的Teslin纸基板上设计出天线阻抗与NXP公司的SL3S1002FTB1,115型超高频标签芯片达成共轭匹配的小型化超高频标签天线。采用本论文技术路线制备出的天线原型,实际测量得到的S11值在915 MHz处为-25dB左右,现场读取距离大约30 cm。本论文所研究的技术路线简洁环保、成本低廉,且由于纸基的柔性特征,还可以实现标签天线的R2R大规模生产,更能发挥规模扩大的边际效益,使得单个标签的生产成本降低到分量级的超低价格,进一步拓展RFID技术的应用范围。
[Abstract]:In recent years, with the development of electronic products in the direction of low cost and flexibility, the traditional rigid circuit boards can not meet the current development needs of electronic devices. The paper based circuit is low cost, degradable and can be folded into three dimensional devices, which is of great significance to the development of flexible electronics. In this paper, the fabrication technology of paper-based full-printed conductive circuit is discussed, which provides a feasible solution for the preparation of paper-based flexible printing circuit. In this paper, we use the combination of printing ink and chemical deposition metal layer to prepare conductive circuit on the paper surface. Because of the high permeability of the solution type catalytic ink on the porous paper surface, the catalytic chemical deposition speed is slow. A colloidal film was formed on the paper substrate by using the colloidal solution of stannous chloride, which is suitable for the pretreatment of the paper surface, to form a colloidal film on the paper substrate. By reducing the penetration depth of the ink from 330 渭 m to 100 渭 m, the metal film can grow into the paper fiber, enhance the adhesion of the metal film, and retain enough catalytic ink on the paper surface to improve the quality of the deposited metal film. The chemical deposition time was optimized and the technological process was improved. The dense, smooth and continuous conductive copper layer was prepared on the paper substrate without any strict environmental requirements and precision equipment instruments. The conductivity of the copper layer is 70% of that of the copper block, and the precision of the line pattern is about 95 渭 m. Through the study of the bending and bending properties of paper based full printed conductive circuit, it is concluded that whether it is bending or bending, paper based all printed conductive circuit will maintain certain electrical conductivity. Furthermore, using the bending and bending properties of paper based fully printed conductive circuit, the prototype of 3D folding device is made in this paper, which shows the potential application value of this technology route. According to the design theory and the basic antenna structure, On a Teslin paper substrate with a thickness of 356 渭 m, a relative dielectric constant of 2.16 and a loss angle tangent of 0.0012, a miniaturized UHF tag antenna with conjugate matching between the antenna impedance and the SL3S1002FTB1115 UHF tag chip of NXP has been designed. The antenna prototype is prepared by the technique route in this paper. The measured S11 value is about -25dB at 915MHz, and the reading distance is about 30cm. The technical route studied in this paper is simple and environmental friendly, low cost, and because of the flexible characteristics of paper, it can also realize the large-scale production of R2R tag antenna, and can play the marginal benefit of scale expansion. The production cost of single tag is reduced to the ultra-low price of component level, and the application of RFID technology is further expanded.
【学位授予单位】：电子科技大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TN41

【参考文献】