基于CuPc的有机二极管与场效应管薄膜封装技术研究

发布时间：2018-07-01 21:04

本文选题：有机场效应管 + 混合薄膜　；参考：《兰州大学》2015年硕士论文

【摘要】：有机电子器件伴随着有机半导体材料的不断研究和器件制备工艺的不断提高,已经取得了令人瞩目的研究成果。同时由于有机电子器件特殊的性能(如柔性、低成本、制备工艺简单等),在很多领域已经拥有了广泛的应用前景；但是有机电子器件的寿命以及稳定性依然是一个十分棘手的问题,并因此得到了十分广泛的关注和研究。本论文主要通过采用不同的封装方法和封装结构对混合薄膜封装进行了研究。在不影响器件性能条件下,提高了器件的寿命和稳定性。论文主要包括以下内容：(1)首先介绍了有机场效应管和二极管的基本结构、工作原理、性能参数等,分析了有机器件中半导体材料以及电极材料失效的原因及所面临的问题。(2)归纳和介绍了现今主要的几种封装方法、封装技术以及封装结构。制备了酞菁铜有机二极管,之后分别采用传统玻璃后盖封装结构,旋涂PVA(聚乙烯醇)有机薄膜与热蒸发LiF薄膜的混合薄膜封装结构,热蒸发LiF薄膜与磁控溅射Er203薄膜的混合薄膜结构对器件进行封装,发现器件在封装之后性能有一定程度的提高。(3)制备了CuPc/C60异质结有机场效应晶体管(OFETs),通过对比分析,选择了热蒸发LiF薄膜与磁控溅射Er203薄膜的混合薄膜结构,对CuPc/C60-OFETs器件进行了封装,封装后通过器件性能的测试以及器件参数的表征,发现器件的寿命以及稳定性有了显著地提高。
[Abstract]:With the continuous research of organic semiconductor materials and the continuous improvement of the fabrication process of organic electronic devices, remarkable research results have been obtained. At the same time, because of the special performance of organic electronic devices (such as flexibility, low cost, simple preparation process, etc.), it has been widely used in many fields. However, the lifetime and stability of organic electronic devices is still a very difficult problem, and has been widely concerned and studied. In this thesis, hybrid film packaging is studied by using different packaging methods and packaging structures. The lifetime and stability of the device are improved without affecting the performance of the device. The main contents of this paper are as follows: (1) the basic structure, working principle, performance parameters of the airfield effect transistor and diode are introduced firstly. The reasons for the failure of semiconductor and electrode materials in organic devices and the problems encountered are analyzed. (2) several main packaging methods, packaging techniques and packaging structures are summarized and introduced. Copper phthalocyanine organic diodes were prepared, and then were encapsulated with traditional glass back cover, mixed film encapsulated with PVA (polyvinyl alcohol) organic film and lif film by thermal evaporation, respectively. The hybrid film structure of lif film and magnetron sputtering er 203 film was used to package the device. It was found that the performance of the device was improved to some extent after encapsulation. (3) CuPc / C60 heterojunction (OFETs) was fabricated. The hybrid structure of lif thin film with magnetron sputtering Er203 film was selected and the CuPc / C60-OFETs device was encapsulated. After the device performance was tested and the device parameters were characterized, it was found that the lifetime and stability of the device were significantly improved.
【学位授予单位】：兰州大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN31

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