温度对单晶硅水下微观磨损的影响
发布时间：2018-07-13 09:18
【摘要】：单晶硅因其优异的物理和化学特性被广泛用作微纳米器件的结构功能材料,而在其化学机械抛光(CMP)加工以及硅基微纳米器件的使用中均存在液下微观磨损问题。温度是影响材料微观磨损(尤其是摩擦化学磨损)的关键因素,但目前相关研究仍然欠缺。例如,单晶硅的CMP加工速率和表面质量与温度密切相关,但对其影响机理还鲜有研究;另外液体环境中微纳米器件的运行极易受到环境温度变化的影响,但对由温度引起的磨损问题仍未进行全面的研究。为了探明环境温度对微纳米器件在液下磨损失效的影响机制,以及深入揭示温度对单晶硅CMP中原子级材料去除的影响机制,需要开展不同水温下单晶硅的微观磨损研究。有鉴于此,本文分别采用多点接触微纳米加工设备和原子力显微镜(AFM)重点研究了液体环境中温度对单晶硅微观磨损的影响规律。为了揭示液体温度对单晶硅微观磨损的影响机理,利用EDX和AFM对不同温度水浴后单晶硅的表面性质进行了表征,并借助拉曼光谱仪(Raman)测试探明了单晶硅磨损后磨屑中Si-H和Si-OH两种基团随温度的变化规律。本论文的主要研究内容与创新点如下:(1)揭示了液体温度对单晶硅微观磨损的影响规律硅/二氧化硅水下微米接触磨损包括机械磨损和摩擦化学磨损,其中摩擦化学磨损为主导。微观条件下单晶硅水下的磨损体积随着水温升高而增加,其中机械磨损部分变化较小,液体温升对硅/二氧化硅的摩擦化学磨损有明显的促进作用。(2)揭示了液体温度对单晶硅摩擦化学磨损的影响规律硅/二氧化硅水下纳米接触磨损由摩擦化学磨损主导。随着水温的升高,原始硅表面经历无明显损伤到磨损产生的变化过程,且产生磨损后磨损深度和体积随着温度升高而逐渐增大。在相同的水温范围内,疏水硅表面均出现损伤,磨损深度和体积先略微增大,在常温25℃时达到最大值,随后迅速减小。(3)初步阐明了温度对单晶硅水下微纳磨损的影响机理单晶硅的水下微米接触磨损的磨损率与水温满足阿伦尼乌斯公式,同时拉曼光谱测试结果显示磨屑中Si-H和Si-OH两种基团的综合强度随着温度的升高而增强。因此,温度通过促进单晶硅表面的水解反应进而加剧微米接触磨损。进一步分析表明,不同水温下单晶硅的摩擦化学磨损可能与其表面的水接触角即表面亲疏水性密切相关。水温升高会增强原始硅表面的疏水性,减小硅/二氧化硅配副间的水膜厚度,从而导致接触界面间更易形成"Si-O-Si"键桥,加剧原始硅表面的微观磨损。与原始硅不同,水温升高会降低疏水硅表面的疏水性,增大接触界面间的水膜厚度,进而阻止配副表面间"Si-O-Si"键桥的形成,从而减弱摩擦化学磨损。
[Abstract]:Monocrystalline silicon has been widely used as structural and functional materials for micro and nano devices due to its excellent physical and chemical properties. However, in the process of chemical mechanical polishing (CMP) and in the use of silicon based micro and nano devices, the problem of micro wear exists in liquid. Temperature is the key factor affecting the micro-wear of materials, especially the tribochemical wear. For example, CMP processing rate and surface quality of monocrystalline silicon are closely related to temperature, but there are few studies on its influence mechanism. In addition, the operation of micro-nano devices in liquid environment is easily affected by environmental temperature change. However, the wear problem caused by temperature has not been fully studied. In order to find out the effect of ambient temperature on the wear failure of microdevices under liquid and to reveal the effect of temperature on the removal of atom-grade materials in monocrystalline silicon (CMP), it is necessary to study the micro-wear of monocrystalline silicon at different water temperatures. In view of this, the effects of temperature on the wear of monocrystalline silicon in liquid environment were studied by means of multi-point contact micromachining equipment and atomic force microscope (AFM), respectively. In order to reveal the effect of liquid temperature on the wear of monocrystalline silicon, edX and AFM were used to characterize the surface properties of monocrystalline silicon after water bath at different temperatures. The changes of Si-H and Si-OH groups with temperature in worn monocrystalline silicon chips were investigated by Raman spectroscopy. The main contents and innovations of this thesis are as follows: (1) the effect of liquid temperature on the micro-wear of monocrystalline silicon is revealed. The micro-contact wear of silicon / silicon dioxide underwater includes mechanical wear and tribochemical wear, in which friction and chemical wear are dominant. The wear volume of monocrystalline silicon increases with the increase of water temperature, and the mechanical wear of monocrystalline silicon increases slightly. (2) the effect of liquid temperature on the tribochemical wear of monocrystalline silicon is revealed. (2) the effect of liquid temperature on the tribochemical wear of monocrystalline silicon is revealed. The underwater nano-contact wear of Si / Sio _ 2 is dominated by tribochemical wear. With the increase of water temperature, the original silicon surface experienced no obvious damage to the wear process, and the wear depth and volume increased with the increase of temperature. In the same range of water temperature, the surface of hydrophobic silicon is damaged, the wear depth and volume increase slightly, and reach the maximum at 25 鈩，
本文编号：2118889
[Abstract]:Monocrystalline silicon has been widely used as structural and functional materials for micro and nano devices due to its excellent physical and chemical properties. However, in the process of chemical mechanical polishing (CMP) and in the use of silicon based micro and nano devices, the problem of micro wear exists in liquid. Temperature is the key factor affecting the micro-wear of materials, especially the tribochemical wear. For example, CMP processing rate and surface quality of monocrystalline silicon are closely related to temperature, but there are few studies on its influence mechanism. In addition, the operation of micro-nano devices in liquid environment is easily affected by environmental temperature change. However, the wear problem caused by temperature has not been fully studied. In order to find out the effect of ambient temperature on the wear failure of microdevices under liquid and to reveal the effect of temperature on the removal of atom-grade materials in monocrystalline silicon (CMP), it is necessary to study the micro-wear of monocrystalline silicon at different water temperatures. In view of this, the effects of temperature on the wear of monocrystalline silicon in liquid environment were studied by means of multi-point contact micromachining equipment and atomic force microscope (AFM), respectively. In order to reveal the effect of liquid temperature on the wear of monocrystalline silicon, edX and AFM were used to characterize the surface properties of monocrystalline silicon after water bath at different temperatures. The changes of Si-H and Si-OH groups with temperature in worn monocrystalline silicon chips were investigated by Raman spectroscopy. The main contents and innovations of this thesis are as follows: (1) the effect of liquid temperature on the micro-wear of monocrystalline silicon is revealed. The micro-contact wear of silicon / silicon dioxide underwater includes mechanical wear and tribochemical wear, in which friction and chemical wear are dominant. The wear volume of monocrystalline silicon increases with the increase of water temperature, and the mechanical wear of monocrystalline silicon increases slightly. (2) the effect of liquid temperature on the tribochemical wear of monocrystalline silicon is revealed. (2) the effect of liquid temperature on the tribochemical wear of monocrystalline silicon is revealed. The underwater nano-contact wear of Si / Sio _ 2 is dominated by tribochemical wear. With the increase of water temperature, the original silicon surface experienced no obvious damage to the wear process, and the wear depth and volume increased with the increase of temperature. In the same range of water temperature, the surface of hydrophobic silicon is damaged, the wear depth and volume increase slightly, and reach the maximum at 25 鈩，
本文编号：2118889
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