添加剂对印制线路板微盲孔填铜效果的影响
发布时间：2018-07-15 19:02
【摘要】：在电流密度1.94 A/dm~2、温度25°C和空气搅拌的条件下,采用由220 g/L CuSO_4·5H_2O、0.54 mol/L H_2SO_4和4种添加剂组成的酸性镀铜液对PCB(印制线路板)微盲孔进行填充。所用添加剂包含Cl-、加速剂(聚二硫二丙烷磺酸钠,SPS)、抑制剂(聚乙二醇-8000,PEG-8000)和整平剂(4,6-二甲基-2-巯基嘧啶,DMP)。通过电化学阻抗谱和阴极极化曲线分析了上述4种添加剂的用量对微盲孔填充效果的影响。结果表明:当Cl-为30~60 mg/L、SPS为0.5~1.0 mg/L,PEG-8000为100~300 mg/L、DMP为1~7 mg/L时,填孔效率最佳,所得镀层表面结构均匀、致密,耐浸锡热冲击和抗高低温循环的性能良好,满足PCB的可靠性要求。
[Abstract]:Under the condition of current density of 1.94 A / D ~ (2), temperature of 25 掳C and air agitation, acid copper plating solution consisting of 220 g / L Cuso _ 4 / L Cuso _ (4) H _ 2O _ (4) 0.54 mol / L / L S _ 2SO _ 4 and 4 additives was used to fill the printed circuit board (PCB) microblind holes. The additives used include Cl-accelerator (SPS), inhibitor (PEG-8000) and leveling agent (4-dimethyl-2-mercaptopyrimidine). By electrochemical impedance spectroscopy and cathodic polarization curves, the effects of the contents of the four additives on the effect of microblind hole filling were analyzed. The results show that when the Cl- is 30 ~ (60) mg / L ~ (-1) SPS = 0.5 ~ (1.0) mg / L ~ (-1) PEG-8000 is 100 ~ 300 mg / L DMP = 1 ~ 7 mg / L, the surface structure of the coating is uniform and dense, and the properties of heat shock resistance and high and low temperature cycle resistance are good, which can meet the reliability requirements of PCB.
【作者单位】： 重庆大学化学化工学院;博敏电子股份有限公司;电子科技大学微电子与固体电子学院;
【基金】：国家自然科学基金(21376282) 广东省“扬帆计划”先进印制电路关键技术研发及产业化项目(2015YT02D025) 汽车电子用高密度智能控制印制电路关键技术及产业化项目(2015B090901032)
【分类号】：TN41
[Abstract]:Under the condition of current density of 1.94 A / D ~ (2), temperature of 25 掳C and air agitation, acid copper plating solution consisting of 220 g / L Cuso _ 4 / L Cuso _ (4) H _ 2O _ (4) 0.54 mol / L / L S _ 2SO _ 4 and 4 additives was used to fill the printed circuit board (PCB) microblind holes. The additives used include Cl-accelerator (SPS), inhibitor (PEG-8000) and leveling agent (4-dimethyl-2-mercaptopyrimidine). By electrochemical impedance spectroscopy and cathodic polarization curves, the effects of the contents of the four additives on the effect of microblind hole filling were analyzed. The results show that when the Cl- is 30 ~ (60) mg / L ~ (-1) SPS = 0.5 ~ (1.0) mg / L ~ (-1) PEG-8000 is 100 ~ 300 mg / L DMP = 1 ~ 7 mg / L, the surface structure of the coating is uniform and dense, and the properties of heat shock resistance and high and low temperature cycle resistance are good, which can meet the reliability requirements of PCB.
【作者单位】： 重庆大学化学化工学院;博敏电子股份有限公司;电子科技大学微电子与固体电子学院;
【基金】：国家自然科学基金(21376282) 广东省“扬帆计划”先进印制电路关键技术研发及产业化项目(2015YT02D025) 汽车电子用高密度智能控制印制电路关键技术及产业化项目(2015B090901032)
【分类号】：TN41
【参考文献】
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