硅微通道阵列高温形变及烧结现象的研究
发布时间：2018-07-31 05:01
【摘要】：硅材料因其良好的热电性能、稳定的化学性质、相对成熟的微机械加工技术被用来作为新型微通道板基体材料。与传统微通道板相比,硅微通道板无论是在器件的增益性能,还是在使用寿命上都有着无法比拟的巨大优势。本文主要针对硅微通道板高温形变特性进行了深入研究,通过观察经高温氧化后的硅微通道板的形貌变化,分析其产生不规则形变的原因是高温环境下热应力所致,并通过ABAQUS有限元模拟软件对硅微通道阵列高温形变特性进行模拟仿真。仿真结果直接反应出了硅微通道阵列所受热应力的分布以及应变情况,在1100℃时,外角的最大热应力达到了307N/m~2,内角的最大热应力为33.7N/m~2,内壁中心点热应力为50.5N/m~2。外交应力大于内角应力,孔道夹角凸起,孔道壁凹陷,将仿真结果与实验结果做对比分析出了硅微通道阵列高温形变特性。通过高温整形实验使硅微通道板恢复平整,在温度1250℃,重量达到200g,高温整形4h时平整度达到0.1,整形效果最佳。本文对硅微通道阵列的烧结现象的进行了研究,并说明了硅微通道阵列烧结现象的存在,以及提出了硅微通道阵列在高温整形中减小烧结现象影响的实验优化方案。
[Abstract]:Because of its good thermoelectric properties, stable chemical properties and relatively mature micromachining technology, silicon material is used as a new type of microchannel substrate material. Compared with traditional microchannel plate, silicon microchannel board has unparalleled advantages in gain performance and service life. In this paper, the deformation characteristics of silicon microchannel plates at high temperature are studied in depth. By observing the morphologies of silicon microchannel plates after high temperature oxidation, the causes of irregular deformation are analyzed, which are caused by thermal stress in high temperature environment. The high temperature deformation characteristics of silicon microchannel array are simulated by ABAQUS finite element simulation software. The simulation results directly reflect the distribution of thermal stress and strain of silicon microchannel array. At 1100 鈩，
本文编号：2154482
[Abstract]:Because of its good thermoelectric properties, stable chemical properties and relatively mature micromachining technology, silicon material is used as a new type of microchannel substrate material. Compared with traditional microchannel plate, silicon microchannel board has unparalleled advantages in gain performance and service life. In this paper, the deformation characteristics of silicon microchannel plates at high temperature are studied in depth. By observing the morphologies of silicon microchannel plates after high temperature oxidation, the causes of irregular deformation are analyzed, which are caused by thermal stress in high temperature environment. The high temperature deformation characteristics of silicon microchannel array are simulated by ABAQUS finite element simulation software. The simulation results directly reflect the distribution of thermal stress and strain of silicon microchannel array. At 1100 鈩，
本文编号：2154482
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