自动砂轮划片机系统研究与设计

发布时间：2018-08-03 12:18

【摘要】：划片机是IC生产在线的关键设备之一,是一种精密切割专用设备,主要用于将半导体集成电路硅片、砷化镓、磷化镓等芯片切割成单个集成电路或管芯的专用精密切割设备。目前国内IC生产在线使用的划片机基本上是全部依赖于进口,其价格昂贵、维修不方便、配件价格高、供货时间长,制约了我国微电子行业的发展。为了我国微电子行业的发展,也为了满足国内半导体厂家对该设备的需求,我们瞄准国际先进技术,自主设计开发自动划片机。本文的主要内容有：首先,介绍了自动砂轮划片机的工作原理和结构组成,通过整机各关键部件多个方案的对比,综合考虑先进性、经济性、可实现性、周期性等因素,确认了最终的整机设计方案。同时,对主机各轴向关键件的设计和选取原则进行了介绍。其次,根据对整个系统允许的总误差以及已定误差、随机误差、系统误差的分析和理论计算,逐一算出各个轴向的精度设计要求,并据此完成了对整机各部件精度的确认。随后,详细介绍了各个轴向和关键零部件的设计方法和过程。本文还介绍了图像对准系统、液路系统、气路系统等辅助装置的原理和设计,该部分辅助装置从根本上确保了整机的可靠运行,是整机技术指标实现的有力保证。此外,还简要介绍了整机的电气设计。最后,整机技术指标的测试结果和实际使用效果表明,该设备的性能达到了预期设计要求。通过该设备切割的芯片,尺寸符合生产要求、外形规整、一致性好,整机性能处于国内同类产品的领先水平,有力的确保了国内半导体生产商的需求。同时,也对自动砂轮划片机的后续发展进行了展望和建议。自动砂轮划片机的研制成功,提高了IC芯片切割的效率和质量,极大地提高了成品率,降低了生产成本。能够满足半导体用户方便、高效、可靠的生产要求,有着极高的性价比。同时,本设备也可用于对玻璃、石英、陶瓷、蓝宝石等脆硬材料的切割、分离,应用领域广,市场需求量大。
[Abstract]:Slicing machine is one of the key equipment in IC production, and it is a kind of special precision cutting equipment, which is mainly used to cut silicon chip, gallium arsenide and gallium phosphide chip into a single integrated circuit or tube core. At present, domestic IC production and online use of slicing machines are basically all rely on imports, its price is expensive, maintenance is not convenient, spare parts high price, long supply time, which restricts the development of China's microelectronics industry. For the development of microelectronics industry in our country, and to meet the demand of semiconductor manufacturers in China, we aim at the international advanced technology and design and develop the automatic slicing machine independently. The main contents of this paper are as follows: firstly, the working principle and structure of automatic grinding wheel slicing machine are introduced. Through the comparison of several schemes of key parts of the whole machine, the advanced nature, economy, realizability, periodicity and other factors are comprehensively considered. The final design of the machine is confirmed. At the same time, the design and selection principle of each axial key part of the host are introduced. Secondly, according to the analysis and theoretical calculation of the total error, fixed error, random error and system error of the whole system, the precision design requirements of each axial direction are calculated one by one, and the accuracy of each component of the whole machine is confirmed accordingly. Then, the design method and process of each axis and key parts are introduced in detail. This paper also introduces the principle and design of image alignment system, liquid circuit system, gas path system and other auxiliary devices. This part of auxiliary device basically ensures the reliable operation of the whole machine and is a powerful guarantee for the realization of the whole machine's technical index. In addition, the electrical design of the whole machine is briefly introduced. Finally, the test results and practical application results show that the performance of the equipment meets the expected design requirements. The chip cut by this equipment meets the requirements of production, the shape is regular, the consistency is good, the performance of the whole machine is in the leading level of the domestic similar products, and the demand of the domestic semiconductor manufacturers is ensured. At the same time, the future development of automatic grinding wheel slicing machine is prospected and suggested. The development of automatic grinding wheel slicing machine improves the efficiency and quality of IC chip cutting, greatly improves the finished product rate and reduces the production cost. Can meet the semiconductor user convenient, efficient, reliable production requirements, has a very high cost-performance ratio. At the same time, the equipment can also be used to cut, separate and apply to brittle hard materials such as glass, quartz, ceramics, sapphire and so on.
【学位授予单位】：西安电子科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN405

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