金属狭缝中连接声表面波器件的平面传输线研究

发布时间：2018-08-25 17:24

【摘要】：金属狭缝等极端环境中进行接触应力的测量有重要的工程应用价值,在课题的前期研究中选用了声表面波传感器进行狭缝中接触应力的测量,本文围绕这一课题背景,研究狭缝中声表面波器件的信号传输问题。本文研究的难点主要为以下几点。第一,在狭缝中传输高频信号,传输线与芯片的互连封装必须有足够薄足够小的尺寸。二,微波频段工作中,金属狭缝对传输线传输性能会产生一定的影响。三,高频工作时为了提高传输效率,SAW芯片需要与传输线阻抗匹配。本文主要是围绕以上几个问题展开的研究,首先对互连方式进行选择并优化互连结构,其次研究了金属狭缝对微带线传输性能的影响,然后设计并加工了SAW芯片与传输线匹配电路并进行实验验证。具体工作内容分以下4方面:1、研究微连接的几种互连方法,选择引线键合作为芯片与传输线间的连接方式。此外,对引线键合的结构(键合线拱高、跨距、直径及根数等)进行优化,以减小键合连接对信号造成的反射,提高信号传输效率。2、在屏蔽微带线的分析方法中选用一种基于准静态法的近似算法来计算微带线传输性能指标(特性阻抗、等效相对介电常数)随金属狭缝宽度的变化。其次,用HFSS软件对金属狭缝中一种微带线的传输进行模拟仿真,仿真结果较为精确,与近似计算相吻合。此外,还分析了金属狭缝对微带线电长度的影响。3、考虑到与微带线的集成以及金属狭缝的影响,选用微带双枝短截线匹配电路进行阻抗匹配。用ADS中的史密斯圆图工具设计出匹配电路,并在HFSS中进行匹配电路的结构优化。此外,还设计出用于键合连接的焊盘。4、对微带线匹配电路进行加工,并与SAW芯片连接封装。实验测试了SAW芯片的静态性能和动态加载性能,并对技术指标进行分析。本文主要针对金属狭缝中高频信号的传输作了相关研究,综合考虑了狭缝影响、结构互连、阻抗匹配以及尺寸限制,优化设计出适合课题背景的声表面波信号传输部分,并完成实验测试,对金属狭缝中接触应力的测量有实际应用价值。
[Abstract]:The measurement of contact stress in metal slit and other extreme environments has important engineering application value. Saw sensor is used to measure the contact stress in the slit in the early stage of the project. This paper revolves around this subject background. The signal transmission of saw devices in slit is studied. The difficulties of this paper are as follows. First, high frequency signals are transmitted in the slit, and the interconnect between transmission lines and chips must be thin enough and small enough. Secondly, metal slit will affect the transmission performance of transmission line in microwave frequency band. Third, in order to improve transmission efficiency, saw chip needs to match with transmission line impedance. This paper mainly focuses on the above problems. Firstly, the interconnect mode is selected and the interconnect structure is optimized. Secondly, the influence of metal slit on the transmission performance of microstrip line is studied. Then the matching circuit between SAW chip and transmission line is designed and fabricated and verified by experiment. The specific work is divided into the following four aspects: 1, study several interconnection methods of micro-connection, select lead key cooperation as the connection mode between chip and transmission line. In addition, the structure of the lead bonding (arch height, span, diameter, root number, etc.) is optimized to reduce the reflection of the signal caused by the bonding connection, In order to improve the signal transmission efficiency, an approximate algorithm based on quasi-static method is used to calculate the variation of the transmission performance index (characteristic impedance, equivalent relative permittivity) with the metal slit width in the analysis method of shielded microstrip lines. Secondly, the transmission of a microstrip line in a metal slit is simulated by HFSS software. The simulation results are accurate and consistent with the approximate calculation. In addition, the influence of metal slit on the electric length of microstrip line is analyzed. Considering the integration with microstrip line and the influence of metal slit, the impedance matching circuit is selected. The matching circuit is designed by using Smith circle diagram tool in ADS, and the structure of matching circuit is optimized in HFSS. In addition, a pad. 4 for bonding connection is designed to process the microstrip line matching circuit and to connect and encapsulate with SAW chip. The static performance and dynamic loading performance of SAW chip are tested and the technical specifications are analyzed. In this paper, the transmission of high frequency signal in metal slit is studied. The influence of slit, structure interconnection, impedance matching and size limitation are considered comprehensively, and the transmission part of saw signal suitable for the background of the subject is optimized. The experiment is carried out and it has practical application value to measure the contact stress in the metal slit.
【学位授予单位】：电子科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN65;TN811
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本文编号：2203583