梁式封装二极管的微组装技术
发布时间：2018-08-25 20:36
【摘要】：该文介绍了梁式封装二极管(BED)的微组装技术(MPT)的现状及其问题,重点对超声热压倒装焊与粘胶互联进行了实验与仿真,分析了不同电极与基板镀层等因素对装配方案的影响,并通过受力实验进行验证。提出了有效规范的装配方案和可靠、易行的工程结论,解决了梁式封装二极管装配方案混乱,批量一致性差,调试难度大,成本高等问题。
[Abstract]:This paper introduces the status quo and problems of microassembly technology (MPT) for beam type packaging diode (BED). The experiment and simulation of ultrasonic heat overwhelm welding and viscose interconnection are carried out, and the influence of different electrode and substrate coating on assembly scheme is analyzed. And through the force experiment to verify. The effective and standard assembly scheme and the reliable and easy engineering conclusion are put forward. The problems such as chaotic assembly scheme of beam packaging diode, poor batch consistency, high debugging difficulty and high cost are solved.
【作者单位】： 中国电子科技集团公司第二十六研究所;
【分类号】：TN31
本文编号：2204026
[Abstract]:This paper introduces the status quo and problems of microassembly technology (MPT) for beam type packaging diode (BED). The experiment and simulation of ultrasonic heat overwhelm welding and viscose interconnection are carried out, and the influence of different electrode and substrate coating on assembly scheme is analyzed. And through the force experiment to verify. The effective and standard assembly scheme and the reliable and easy engineering conclusion are put forward. The problems such as chaotic assembly scheme of beam packaging diode, poor batch consistency, high debugging difficulty and high cost are solved.
【作者单位】： 中国电子科技集团公司第二十六研究所;
【分类号】：TN31
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，本文编号：2204026
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