晶圆激光切割技术的研究进展

发布时间：2018-08-26 12:12

【摘要】：综述了半导体领域晶圆切割技术的发展进程,介绍了刀片切割技术、传统激光切割技术、新型激光切割技术及整形激光切割技术的特点、工作原理和优缺点以及国内外使用晶圆切割技术获得的研究成果及其应用前景。与刀片切割技术相比,激光切割技术具有切割质量好、切割速度快等优点。详细介绍了以进一步改善晶圆切割质量和提高切割速度为目的的几类整形激光切割技术,包括微水导激光切割技术、隐形切割技术、多焦点光束切割、"线聚焦"切割、平顶光束切割和多光束切割等。随着技术的不断完善、切割设备的不断成熟,整形激光切割技术在未来的晶圆切割领域将具有广阔的应用前景。
[Abstract]:The development of wafer cutting technology in semiconductor field is reviewed. The characteristics of blade cutting technology, traditional laser cutting technology, new laser cutting technology and shaping laser cutting technology are introduced. Working principle, advantages and disadvantages, research results and application prospect of wafer cutting technology at home and abroad. Compared with blade cutting technology, laser cutting technology has the advantages of good cutting quality and fast cutting speed. In this paper, several kinds of plastic laser cutting technology aiming at improving the cutting quality of wafer and increasing cutting speed are introduced in detail, including micro-hydraulic laser cutting, stealth cutting, multi-focus beam cutting, "line focusing" cutting. Flat-top beam cutting and multi-beam cutting, etc. With the continuous improvement of technology and the maturity of cutting equipment, plastic laser cutting technology will have a broad application prospect in the field of wafer cutting in the future.
【作者单位】：桂林电子科技大学广西精密导航技术与应用重点实验室;中国科学院微电子研究所微电子设备技术研究室;中国科学院半导体研究所;清华大学精密仪器系微纳制造器件与系统协同创新中心精密测试技术及仪器国家重点实验室;
【基金】：国家自然科学基金资助项目(61376083,61474031) 广西自然科学基金资助项目(2016GXNSFDA380021) 广西十百千人才工程资助项目中国科学院装备研制项目;中国科学院微电子器件与集成技术重点实验室资助项目射频电路与系统教育部重点实验室(杭州电子科技大学)资助项目
【分类号】：TN305.1

【相似文献】