微坑阵列模具掩膜电化学刻蚀研究

发布时间：2018-10-29 08:39

【摘要】：随着MEMS技术的快速发展,细胞生物学、水环境污染分析、蛋白质分离等领域对微流控芯片的需求愈加强烈,同时,与金属模具制造技术相关的掩膜电化学刻蚀工艺也受到了密切关注。本文主要研究了两种金属材料微坑阵列模具的制作工艺：模具钢与镍微坑阵列模具。研究结果能够为金属模具制作相关领域提供工艺参考。利用COMSOL软件对单个微坑及微坑阵列的电流密度分布规律进行了有限元分析。首先,本文分别对单个微坑及微坑阵列进行了建模,掩膜孔径分别取50μm与100μm。然后,分别设置边界条件,电流密度设定为5A/dm2。最后,通过求解及后处理,得到了阳极表面电流密度的分布规律,为掩膜电化学刻蚀微坑阵列提供了参考。对掩膜电化学刻蚀模具钢微坑阵列模具进行了实验研究。首先,本文采用BN308光刻胶作为掩膜并通过实验分析了抛光工艺对刻蚀均匀性的影响。然后,研究了酸洗对基板刻蚀的影响,得出酸洗可以改善刻蚀均匀性的结论,并通过调节溶液pH的方法,解决了沉淀问题。最后,通过高低电流密度搭配(10A/dm2、5A/dm2)的加工方法,改善了微坑阵列均匀性。对掩膜电化学刻蚀镍微坑阵列模具进行了实验研究。首先,本文通过引入变异系数的方法,定量分析了掩膜孔径与电流密度对微坑阵列均匀性的影响。然后,通过基板抛光、酸洗工艺及调节pH的方法,提高了微坑阵列均匀性并解决了溶液的沉淀问题。对掩膜电化学刻蚀镍凹槽模具进行了探索性研究。本文通过掩膜电化学刻蚀方法加工了不同线宽的凹槽,并讨论了不同线宽与加工区域凹槽的侧蚀量与蚀刻系数。
[Abstract]:With the rapid development of MEMS technology, the demand for microfluidic chips is increasing in the fields of cell biology, water pollution analysis, protein separation and so on. The mask electrochemical etching technology related to metal die manufacturing technology has also received close attention. In this paper, the fabrication process of two kinds of metal materials microcrater array die: die steel and nickel microcrater array die is studied. The results can be used as a reference for metal die making related fields. The current density distribution of single microcrater and microcrater array is analyzed by using COMSOL software. Firstly, a single microcrater and a microcrater array are modeled, and the mask aperture is 50 渭 m and 100 渭 m, respectively. Then, the boundary conditions are set, and the current density is set to 5 A / DM 2. Finally, the distribution of the current density on the anode surface is obtained by solving and post-processing, which provides a reference for the mask electrochemical etching microcrater array. An experimental study was carried out on the steel microcrater array die for the electrochemical etching of the mask. Firstly, BN308 photoresist is used as mask and the effect of polishing process on etching uniformity is analyzed experimentally. Then, the effect of pickling on substrate etching was studied, and the conclusion that acid pickling could improve etching uniformity was concluded, and the precipitation problem was solved by adjusting solution pH. Finally, the uniformity of the microcrater array is improved by the method of high and low current density collocation (10A / dm ~ (2) / 5 A / D ~ (2). An experimental study on the electrochemical etching of nickel microcrater array die by mask was carried out. Firstly, the influence of mask aperture and current density on the uniformity of the microcrater array is quantitatively analyzed by introducing the coefficient of variation. Then, by polishing substrate, pickling and adjusting pH, the uniformity of microcrater array is improved and the solution precipitation problem is solved. An exploratory study on the electrochemical etching of nickel grooves with mask was carried out. In this paper, the grooves with different linewidths are fabricated by means of mask electrochemical etching, and the side erosion amount and etching coefficient of grooves in different linewidths and machining regions are discussed.
【学位授予单位】：大连理工大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN305.7

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