三模导航用倒装焊声表面波滤波器的研制

发布时间：2018-10-30 11:09

【摘要】：声表面波滤波器是用来做信号处理用的电子器件,和其它滤波器功能一样,去除干扰信号,让有用的信号传输通过。其工作原理是在器件的输入端输入电信号,电信号激励声波,声波在器件内部处理后再还原为电信号。近年来,随着通讯事业的快速发展,对滤波器的需求越来越多。声表面波滤波器具有很好的高频性能、一致性好、尺寸小、适合量产等优点,使其发展越来越快,应用领域也不断扩大,使得声表面波器件越来越得到重视。第三代和第四代移动通讯技术要求通讯系统向高频、多模式方向发展,这给声表面波滤波器带来了更高的要求。高频、宽带、较低的插入损耗、较小的封装尺寸成为近年来声表面波滤波器研制的难点和热点。目前移动通讯市场上需求一款能满足三种模式(CAMPASS,GPS,GLONASS)的手机导航用声表面波滤波器,中心频率为1575MHz,带宽为40MHz,插入损耗小于1.8dB,封装尺寸为1.1mm×0.9mm×0.5mm,采用FLIP CHIP封装形式。目前我们具备该产品的研制条件,如能量产,可带来一定的经济价值,同时在封装工艺上实现新的突破,打破日本和欧美国家在手机用声表面波器件供应上的垄断地位。本文以研制上述滤波器为目的,介绍了声表面波器件的研制流程和生产工艺过程。对具体的工艺原理和细节进行了分析,重点阐述了小尺寸封装的实现方法。针对封装过程中遇到的实际问题,分析了影响封装质量的因素,给出解决方案。器件的芯片设计上采用DMS结构,芯片工艺采用电子束蒸发铝膜、S1805光刻胶、UV光步进投影光刻、湿法腐蚀工艺;器件封装上使用FLIP CHIP工艺,置球、超声倒装焊接和注塑成型。封装后滤波器的性能参数、稳定性和可靠性等指标均达到设计要求,封装尺寸符合设计要求,可以量产。器件的封装尺寸由1.4mm×1.1mm×0.6mm缩小到l.lmm×0.9mm×0.5mm,达到国际先进国内领先水平。
[Abstract]:Saw filter is an electronic device used for signal processing. As with other filter functions, the interference signal is removed and the useful signal is transmitted through. Its working principle is to input the electric signal at the input end of the device, the electric signal excites the sound wave, and the sound wave is processed inside the device and then reduced to the electric signal. In recent years, with the rapid development of communications, the demand for filters is increasing. Saw filters have many advantages such as good high frequency performance, good consistency, small size, suitable for mass production, etc., which make the development of saw filters faster and faster, and its application field is expanding constantly, which makes saw devices get more and more attention. The third and fourth generation mobile communication technology requires the communication system to develop in the direction of high frequency and multi-mode, which brings higher requirements to saw filters. High frequency, wide band, low insertion loss and small package size have become the difficulties and hot spots in the research of saw filters in recent years. At present, the mobile communication market needs a saw filter for mobile phone navigation which can satisfy three modes (CAMPASS,GPS,GLONASS). The center frequency is 1575MHz, the bandwidth is 40MHz, the insertion loss is less than 1.8 dB, and the package size is 1.1mm 脳 0.9mm 脳 0.5mm. FLIP CHIP package is adopted. At present, we have the conditions for the development of this product, such as mass production, which can bring certain economic value. At the same time, we can achieve a new breakthrough in packaging technology and break the monopoly position of Japan, Europe and the United States in the supply of saw devices for mobile phones. In this paper, the development process and production process of saw devices are introduced. The process principle and detail are analyzed, and the realization method of small-size package is expounded. In view of the practical problems encountered in the process of packaging, the factors affecting the quality of packaging are analyzed, and the solutions are given. DMS structure is used in chip design, electron beam evaporative aluminum film, S1805 photoresist, UV photostep projection lithography, wet etching process are used in chip design, and FLIP CHIP process, ball setting, ultrasonic inversion welding and injection molding are used in device package. The performance parameters, stability and reliability of the encapsulated filter meet the design requirements, and the package size meets the design requirements and can be mass-produced. The package size of the device is reduced from 1.4mm 脳 1.1mm 脳 0.6mm to l.lmm 脳 0.9mm 脳 0.5mm, which reaches the international advanced and domestic leading level.
【学位授予单位】：东南大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TN713

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