硅通孔焊点热疲劳寿命估算及不确定性研究
发布时间：2018-10-31 20:04
【摘要】：随着市场对产品功能的需求不断提升,传统的二维电子封装技术遇到的瓶颈问题越来越突出,三维集成技术逐渐成为主流。硅通孔技术(Through Silicon Via,TSV)即通过在芯片间和晶圆间的垂直通孔中填充导体,进而实现芯片互连。这种芯片互连方式突出优点是封装体体积小、性能强、信号传递速度快,缺点是整体散热能力降低。这使得TSV技术面临的最主要挑战依然集中在与热相关的失效问题上。另外,在集成电路封装设计工作中广泛应用的是基于确定性参数的数值仿真手段。但事实上,任何实际结构都存在不同程度的不确定性,将不确定问题作为确定性问题来计算,得到的结果会过于保守,区间分析方法为解决这类问题提供了一条路径。针对TSV技术封装组件中焊点的热失效问题,本文开展了封装组件热力耦合问题相关研究工作,主要内容包含如下几个方面:1、选取基于TSV技术互连的结构模型,利用ANSYS有限元软件建立起简化的二维数值模型并进行热力耦合计算,参照JEDEC标准温度载荷,用粘塑性本构Anand方程来描述SnPb钎料焊点的力学行为。根据模型的温度场、应力/应变场的结果发现危险焊点位置,利用Engelmaier提出的修正Coffin-Manson经验方程估算危险焊点的热疲劳寿命,以便进行产品可靠性的预测。2、探讨改变单一参量值包括芯片大小、芯片层数、基板厚度以及通孔直径、通孔深度、通孔间距对焊点的热疲劳寿命的影响。记录每列焊点温度、应力、应变等数据并拟合出变化曲线,计算比较各参量值对焊点的疲劳寿命的影响程度,总结出焊点疲劳寿命随所选参量的变化规律,得到的结论为相关设计与优化工作提供理论参考。3、针对TSV模型结构在实际制作过程中存在大量不确定因素的现实,考虑将热物性参数等不确定参数作为区间变量,主要结合有限元法和区间分析法,对TSV结构热传导问题进行区间不确定分析。通过对TSV模型进行确定参数的热力耦合计算以及具有不确定参数的区间分析,得到模型结构尺寸参数和构成材料的物理参数对焊点疲劳寿命的影响规律,为电子封装热问题的研究提供了有价值的参考。
[Abstract]:With the increasing demand for product function in the market, the bottleneck of traditional two-dimensional electronic packaging technology is becoming more and more prominent, and three-dimensional integration technology is gradually becoming the mainstream. Silicon through hole technology (Through Silicon Via,TSV) is to interconnect chips by filling the vertical holes between chips and wafers. The advantages of this kind of chip interconnection are small size, strong performance, fast signal transfer speed and low overall heat dissipation ability. This makes the main challenge for TSV technology to remain focused on thermal-related failures. In addition, the numerical simulation method based on deterministic parameters is widely used in IC package design. But in fact, any real structure has different degree of uncertainty, and the result of the uncertain problem as a deterministic problem will be too conservative. The interval analysis method provides a way to solve this kind of problem. Aiming at the thermal failure problem of solder joint in TSV encapsulation assembly, this paper has carried out the research work related to the thermal coupling problem of package assembly. The main contents include the following aspects: 1. The structural model based on TSV technology interconnection is selected. A simplified two-dimensional numerical model was established by using ANSYS finite element software, and the mechanical behavior of solder joint of SnPb solder was described by viscoplastic constitutive Anand equation with reference to the standard temperature load of JEDEC. According to the results of temperature field and stress / strain field of the model, the location of dangerous solder joint is found. The thermal fatigue life of dangerous solder joint is estimated by using the modified Coffin-Manson empirical equation proposed by Engelmaier in order to predict the reliability of product. The influence of changing single parameter value including chip size, chip layer number, substrate thickness, through hole diameter, through hole depth and through hole spacing on thermal fatigue life of solder joint is discussed. The data of solder joint temperature, stress and strain in each column were recorded and the curve was fitted. The influence of each parameter on the fatigue life of solder joint was calculated and compared, and the variation of fatigue life of solder joint with the selected parameters was summarized. The conclusion provides a theoretical reference for the related design and optimization work. 3. In view of the fact that there are a lot of uncertain factors in the process of making TSV model structure, the uncertain parameters such as thermal physical properties are considered as interval variables. Combined with finite element method and interval analysis method, the interval uncertainty analysis of heat conduction problem of TSV structure is carried out. Based on the thermodynamic coupling calculation of the TSV model and the interval analysis with uncertain parameters, the influence of the structural parameters of the model and the physical parameters of the material on the fatigue life of the solder joint is obtained. It provides a valuable reference for the thermal research of electronic packaging.
【学位授予单位】：大连交通大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN405
本文编号：2303388
[Abstract]:With the increasing demand for product function in the market, the bottleneck of traditional two-dimensional electronic packaging technology is becoming more and more prominent, and three-dimensional integration technology is gradually becoming the mainstream. Silicon through hole technology (Through Silicon Via,TSV) is to interconnect chips by filling the vertical holes between chips and wafers. The advantages of this kind of chip interconnection are small size, strong performance, fast signal transfer speed and low overall heat dissipation ability. This makes the main challenge for TSV technology to remain focused on thermal-related failures. In addition, the numerical simulation method based on deterministic parameters is widely used in IC package design. But in fact, any real structure has different degree of uncertainty, and the result of the uncertain problem as a deterministic problem will be too conservative. The interval analysis method provides a way to solve this kind of problem. Aiming at the thermal failure problem of solder joint in TSV encapsulation assembly, this paper has carried out the research work related to the thermal coupling problem of package assembly. The main contents include the following aspects: 1. The structural model based on TSV technology interconnection is selected. A simplified two-dimensional numerical model was established by using ANSYS finite element software, and the mechanical behavior of solder joint of SnPb solder was described by viscoplastic constitutive Anand equation with reference to the standard temperature load of JEDEC. According to the results of temperature field and stress / strain field of the model, the location of dangerous solder joint is found. The thermal fatigue life of dangerous solder joint is estimated by using the modified Coffin-Manson empirical equation proposed by Engelmaier in order to predict the reliability of product. The influence of changing single parameter value including chip size, chip layer number, substrate thickness, through hole diameter, through hole depth and through hole spacing on thermal fatigue life of solder joint is discussed. The data of solder joint temperature, stress and strain in each column were recorded and the curve was fitted. The influence of each parameter on the fatigue life of solder joint was calculated and compared, and the variation of fatigue life of solder joint with the selected parameters was summarized. The conclusion provides a theoretical reference for the related design and optimization work. 3. In view of the fact that there are a lot of uncertain factors in the process of making TSV model structure, the uncertain parameters such as thermal physical properties are considered as interval variables. Combined with finite element method and interval analysis method, the interval uncertainty analysis of heat conduction problem of TSV structure is carried out. Based on the thermodynamic coupling calculation of the TSV model and the interval analysis with uncertain parameters, the influence of the structural parameters of the model and the physical parameters of the material on the fatigue life of the solder joint is obtained. It provides a valuable reference for the thermal research of electronic packaging.
【学位授予单位】：大连交通大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN405
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