弯曲半径对柔性电子器件层间分离的影响
发布时间：2018-11-02 08:22
【摘要】：根据欧拉梁理论建立了多层柔性电子器件变形弯曲下能量释放率的数学计算模型,得到了给定条件下能量释放率与半径的关系式,并利用虚拟裂纹闭合法对理论模型进行了验证,进一步分析了弯曲半径对给定器件粘结层分离的影响。该研究为防止器件失效提供了理论参考,对柔性电子器件制造及应用具有参考意义。
[Abstract]:According to Eulerian beam theory, a mathematical model of energy release rate under deformation and bending of multilayer flexible electronic devices is established, and the relation between energy release rate and radius under given conditions is obtained. The virtual crack closure method is used to verify the theoretical model, and the influence of bending radius on the separation of bond layer for given device is further analyzed. The research provides a theoretical reference for preventing device failure and has reference significance for the manufacture and application of flexible electronic devices.
【作者单位】： 中国工程物理研究院总体工程研究所;华中科技大学数字制造装备与技术国家重点实验室;
【分类号】：TN05
本文编号：2305466
[Abstract]:According to Eulerian beam theory, a mathematical model of energy release rate under deformation and bending of multilayer flexible electronic devices is established, and the relation between energy release rate and radius under given conditions is obtained. The virtual crack closure method is used to verify the theoretical model, and the influence of bending radius on the separation of bond layer for given device is further analyzed. The research provides a theoretical reference for preventing device failure and has reference significance for the manufacture and application of flexible electronic devices.
【作者单位】： 中国工程物理研究院总体工程研究所;华中科技大学数字制造装备与技术国家重点实验室;
【分类号】：TN05
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，本文编号：2305466
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