基于多物理场的焊球缺陷检测方法

发布时间：2018-11-05 18:23

【摘要】：为检测倒装焊芯片在生产和服役过程中产生的焊球缺陷,提出了基于电、磁、热多物理场的脉冲涡流热成像检测方法.该方法利用有限元COMSOL软件建立焊球电磁感应热模型,并引入常见的焊球缺陷(空洞和裂纹)进行仿真;提取焊球顶端的温度分布,分析不同缺陷焊球的传热性能并进行缺陷识别;仿真分析裂纹和空洞尺寸变化对温度分布的影响,定量分析焊球缺陷.结果表明:在加热结束时,裂纹(长200μm,高20μm)焊球、空洞(直径150μm)焊球与正常焊球的顶端温度差为一负一正,根据焊球顶端温度的分布特征可以区别不同缺陷焊球,对于裂纹焊球,当裂纹位置越靠近焊球顶端,温度值越高;对于空洞焊球,空洞半径从35μm增大到75μm时,焊球顶端温度呈线性增加.
[Abstract]:In order to detect the defects of welding ball produced in the process of production and service, a method of pulsed eddy current thermal imaging based on electric, magnetic and thermal multi-physical fields is proposed. In this method, the electromagnetic induction heat model of solder ball is established by finite element COMSOL software, and the common defects (cavity and crack) are introduced to simulate. The temperature distribution at the top of the ball is extracted, the heat transfer performance of the ball with different defects is analyzed and the defect identification is carried out. The effect of the change of crack and cavity size on the temperature distribution is analyzed by simulation, and the defects of the ball are quantitatively analyzed. The results show that at the end of heating, the crack (200 渭 m long, 20 渭 m high) welding ball, the hole (150 渭 m diameter) welding ball and the normal ball tip temperature difference is negative and one positive. According to the distribution characteristics of the top temperature of the ball, different defect solder balls can be distinguished. For the crack soldering ball, the higher the temperature is, the closer the crack position is to the top of the weld ball. When the radius of cavity is increased from 35 渭 m to 75 渭 m, the temperature at the top of the ball increases linearly.
【作者单位】：电子科技大学自动化工程学院;
【基金】：国家自然科学基金资助项目(61271035) 中央高校青年基金资助项目(ZYGX2013J090)
【分类号】：TN405

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