压接型IGBT器件内部压力分布

发布时间：2018-11-09 15:22

【摘要】：压接型IGBT器件内部各组件直接堆叠在一起,通过外部压力使得各组件间保持良好的机械与电气接触,进而引入一定比例的接触电阻和接触热阻,所以器件内部的压力分布不仅影响器件内部的电流分布和温度分布,还将严重影响器件的可靠性。基于压接型IGBT器件的有限元计算模型和特殊的应用工况,研究压接型IGBT器件内部的压力分布情况,重点探讨器件内部各组件加工误差与内部的布局方式对器件内部压力分布的影响。通过压力夹具和压力纸等进行压接型IGBT器件内部压力分布的实验,实验结果不仅验证了有限元模型和边界条件的正确性,还表明外部压力加载对器件内部压力分布的影响。
[Abstract]:The internal components of the IGBT device are stacked directly together, and the mechanical and electrical contact between the components is maintained by external pressure, and a certain proportion of contact resistance and contact thermal resistance are introduced. Therefore, the pressure distribution not only affects the current distribution and temperature distribution, but also seriously affects the reliability of the device. Based on the finite element calculation model and special application conditions of IGBT devices, the pressure distribution inside the pressure-bonded IGBT devices is studied. The influence of machining error and internal layout on the internal pressure distribution of the device is discussed. The internal pressure distribution of IGBT devices is tested by pressure clamp and pressure paper. The experimental results not only verify the correctness of the finite element model and boundary conditions, but also show the influence of external pressure loading on the internal pressure distribution of IGBT devices.
【作者单位】：新能源电力系统国家重点实验室(华北电力大学);国家电网全球能源互联网研究院;
【基金】：国家自然科学基金项目(51477048) 国家能源应用技术研究及工程示范项目(NY20150705) 国家电网公司科技项目(5455GB160006)资助
【分类号】：TN322.8

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