多芯片组件的扩展热阻与热耦合效应研究

发布时间：2018-11-17 13:06

【摘要】：随着科学技术的快速发展,多芯片组件技术以其体积小、组装密度高、性能高、可靠性高等特点成为了当前电子产品领域研究和发展的热点。与此同时,产品的功能不断增加,单位体积的功耗越来越大,设备内部的热流密度日益增高,最终导致电子元件温度过高,严重影响了产品的可靠性,散热已经成为电子设备应用中必不可少的一项任务。本文通过理论、仿真、实验三者相结合的分析方法开展了以下工作:首先,以单芯片组件的扩展热阻为研究对象,对比分析各种相关计算理论的特点;针对简单矩形热源模型,基于理论计算与FLOEFD仿真分析对比,验证仿真计算的正确性;在此基础上,研究扩展热阻与模型各影响参数之间的变化规律,并利用响应曲面法得到扩展热阻关于各因素的响应模型,为进一步改善电子产品的散热性能提供方案参考。其次,针对多芯片组件的热耦合效应,通过建立热阻网络模型和热阻矩阵两种方法分别理论计算两芯片组件和四芯片组件的温度,并与FLOEFD仿真值进行对比,验证仿真计算的正确性;然后通过仿真分析研究模型参数的变化对于热耦合效应的影响,对于多芯片组件的热可靠性设计有着参考意义。最后,为了实验验证多芯片组件的热阻特性,针对扩展热阻模型和热耦合模型设计热实验平台并进行搭建,使其能够测得芯片或基板的温度情况。在此基础上,通过数据处理将实验结果与软件仿真进行对比,验证了模型热阻与各参数之间的变化规律,并对实验中可能产生的误差进行分析。
[Abstract]:With the rapid development of science and technology, multi-chip module technology has become a hot spot in the field of electronic products because of its small size, high assembly density, high performance and high reliability. At the same time, the function of the product is increasing, the power consumption per unit volume is increasing, and the heat flux inside the equipment is increasing. Finally, the temperature of the electronic component is too high, which seriously affects the reliability of the product. Heat dissipation has become an indispensable task in the application of electronic equipment. In this paper, the following work is carried out through the combination of theory, simulation and experiment. Firstly, the characteristics of various related calculation theories are compared and analyzed by taking the extended thermal resistance of a single chip assembly as the research object. For the simple rectangular heat source model, the correctness of the simulation calculation is verified by comparing the theoretical calculation with the FLOEFD simulation analysis. On this basis, the law of variation between the extended thermal resistance and the influence parameters of the model is studied, and the response model of the extended thermal resistance on each factor is obtained by using the response surface method, which provides a scheme reference for further improving the heat dissipation performance of electronic products. Secondly, in view of the thermal coupling effect of multi-chip components, the temperature of two chip components and four chip components are calculated by establishing thermal resistance network model and thermal resistance matrix, respectively, and compared with the simulation value of FLOEFD. Verify the correctness of the simulation calculation; Then, the influence of the model parameters on the thermal coupling effect is studied by simulation analysis, which has reference significance for the thermal reliability design of multi-chip modules. Finally, in order to verify the thermal resistance characteristics of multi-chip modules, a thermal experimental platform is designed and built for the extended thermal resistance model and the thermal coupling model, so that the temperature of the chip or substrate can be measured. On this basis, the experimental results are compared with the software simulation through data processing to verify the variation of the thermal resistance of the model and the parameters, and the possible errors in the experiment are analyzed.
【学位授予单位】：西安电子科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN02

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