不同温度环境下POP堆叠封装的可靠性研究
发布时间：2018-11-19 15:28
【摘要】：由于信息技术的快速发展,半导体工业跟随着取得了持续的进步。封装测试作为半导体工业的重要部分,对IC产品的整体性能和品质起到至关重要的作用。如今移动电子设备市场迅猛发展,许多手机、平板电脑、相机等消费电子产品都开始涉及POP(package-on-package)形式的封装,其可靠性受到的重视程度越来越高。更多的新产品要求提升产品性能的同时缩小产品的尺寸,POP的出现满足了这样的要求,开始获得广泛应用。但是由于封装密度的不断提高,电子产品在使用过程中会因热量累积而影响其可靠性。本文针对POP封装在温度环境下的可靠性进行了研究,主要做了如下工作:利用实验方法测试了14mm POP芯片在温度冲击环境下的应变特性,得出芯片顶层和底层焊点的应变值大小。对14mm和15mm POP芯片进行了温度循环与温度冲击离线耦合环境下的测试,得出芯片顶层和底层焊点应变值大小。无论温度冲击环境还是离线耦合环境,POP顶层焊点和底层焊点应变都呈现出周期性变化规律,在冲击过程中应变变化较大,而且底层焊点的应变整体上大于顶层焊点。根据应变值大小可得出其相应的可靠性寿命。通过POP温度冲击环境下有限元模拟分析得知,应力主要集中在焊点和芯片。底层芯片最大应力大于顶层的两块芯片。底层焊点应力整体上大于顶层焊点,且底层焊点应力最大值在最外圈角端焊点上。对相同芯片在温度冲击和离线耦合环境下的应变变化进行对比分析,温度冲击下焊点应变从零开始,而离线耦合下应变有一个起始值,说明离线耦合实验中温度循环对其产生了一定的残余应力。离线耦合环境下焊点应变整体上大于温度冲击环境下的应变,焊点更容易发生失效。相同的温度循环与温度冲击离线耦合环境下对不同尺寸的封装测试结果进行了对比分析,14mm POP和15mm POP的应变起始值都不为零,15mm POP的应变整体上要大于14mm POP的应变,尤其是在温度突变阶段,两者应变差值更加明显。这可能是由于两种POP的焊点大小和封装尺寸不同带来的影响。综上所述,本文通过实验测试和模拟的方法对温度环境下POP封装进行了可靠性分析。对比了不同温度环境下相同尺寸POP以及不同尺寸POP相同温度环境下的可靠性。同时,对比了实验结果与有限元模拟结果,验证了模型的正确性。本文分析结果可以为以后的POP封装测试以及可靠性分析提供参考依据。
[Abstract]:With the rapid development of information technology, the semiconductor industry has made continuous progress. As an important part of semiconductor industry, package testing plays an important role in the overall performance and quality of IC products. Nowadays, with the rapid development of mobile electronics market, many consumer electronic products, such as mobile phones, tablets, cameras and so on, begin to be packaged in the form of POP (package-on-package), and their reliability is paid more and more attention. More new products are required to improve the performance of products while reducing the size of products, the emergence of POP to meet such requirements, began to be widely used. However, due to the increasing of packaging density, the reliability of electronic products will be affected by heat accumulation. In this paper, the reliability of POP packaging in temperature environment is studied. The main work is as follows: the strain characteristics of 14mm POP chip under temperature shock environment are tested by experimental method, and the strain values of top layer and bottom solder joint are obtained. The 14mm and 15mm POP chips were tested under the coupled environment of temperature cycling and temperature shock, and the strain values of the top and bottom solder joints were obtained. Regardless of the temperature impact environment or the off-line coupling environment, the strain of the top solder joint and the bottom solder joint of POP show periodic variation law, and the strain of the bottom solder joint is larger than that of the top layer solder joint as a whole during the impact process. According to the strain value, the corresponding reliability life can be obtained. Finite element analysis under POP temperature impact environment shows that the stress is mainly focused on solder joints and chips. The maximum stress of the bottom chip is greater than that of the top two chips. The stress of bottom solder joint is larger than that of top layer solder joint, and the maximum stress of bottom solder joint is at the corner of the outer ring. The strain changes of the same chip under temperature shock and off-line coupling are compared. The solder joint strain starts from zero under temperature shock, while the strain under off-line coupling has a starting value. The results show that the temperature cycle produces a certain residual stress in the off-line coupling experiment. The strain of solder joint in the off-line coupling environment is larger than that in the temperature impact environment, and the solder joint is more prone to failure. The results of packaging tests of different sizes under the same temperature cycle and temperature shock coupling environment are compared and analyzed. The initial strain values of 14mm POP and 15mm POP are not zero, and the strain of 15mm POP is larger than that of 14mm POP on the whole. Especially in the temperature abrupt phase, the strain difference between the two is more obvious. This may be due to the difference in solder joint size and package size between the two POP types. To sum up, the reliability of POP packaging under temperature environment is analyzed by means of experimental test and simulation. The reliability of the same size POP and different size POP at the same temperature were compared. At the same time, the correctness of the model is verified by comparing the experimental results with the finite element simulation results. The results of this paper can provide reference for POP packaging test and reliability analysis.
【学位授予单位】：江苏大学
【学位级别】：硕士
【学位授予年份】：2016
【分类号】：TN405
[Abstract]:With the rapid development of information technology, the semiconductor industry has made continuous progress. As an important part of semiconductor industry, package testing plays an important role in the overall performance and quality of IC products. Nowadays, with the rapid development of mobile electronics market, many consumer electronic products, such as mobile phones, tablets, cameras and so on, begin to be packaged in the form of POP (package-on-package), and their reliability is paid more and more attention. More new products are required to improve the performance of products while reducing the size of products, the emergence of POP to meet such requirements, began to be widely used. However, due to the increasing of packaging density, the reliability of electronic products will be affected by heat accumulation. In this paper, the reliability of POP packaging in temperature environment is studied. The main work is as follows: the strain characteristics of 14mm POP chip under temperature shock environment are tested by experimental method, and the strain values of top layer and bottom solder joint are obtained. The 14mm and 15mm POP chips were tested under the coupled environment of temperature cycling and temperature shock, and the strain values of the top and bottom solder joints were obtained. Regardless of the temperature impact environment or the off-line coupling environment, the strain of the top solder joint and the bottom solder joint of POP show periodic variation law, and the strain of the bottom solder joint is larger than that of the top layer solder joint as a whole during the impact process. According to the strain value, the corresponding reliability life can be obtained. Finite element analysis under POP temperature impact environment shows that the stress is mainly focused on solder joints and chips. The maximum stress of the bottom chip is greater than that of the top two chips. The stress of bottom solder joint is larger than that of top layer solder joint, and the maximum stress of bottom solder joint is at the corner of the outer ring. The strain changes of the same chip under temperature shock and off-line coupling are compared. The solder joint strain starts from zero under temperature shock, while the strain under off-line coupling has a starting value. The results show that the temperature cycle produces a certain residual stress in the off-line coupling experiment. The strain of solder joint in the off-line coupling environment is larger than that in the temperature impact environment, and the solder joint is more prone to failure. The results of packaging tests of different sizes under the same temperature cycle and temperature shock coupling environment are compared and analyzed. The initial strain values of 14mm POP and 15mm POP are not zero, and the strain of 15mm POP is larger than that of 14mm POP on the whole. Especially in the temperature abrupt phase, the strain difference between the two is more obvious. This may be due to the difference in solder joint size and package size between the two POP types. To sum up, the reliability of POP packaging under temperature environment is analyzed by means of experimental test and simulation. The reliability of the same size POP and different size POP at the same temperature were compared. At the same time, the correctness of the model is verified by comparing the experimental results with the finite element simulation results. The results of this paper can provide reference for POP packaging test and reliability analysis.
【学位授予单位】：江苏大学
【学位级别】：硕士
【学位授予年份】：2016
【分类号】：TN405
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