基于壳温的IGBT模块键合引线疲劳寿命预测
发布时间：2018-11-20 14:33
【摘要】：为了研究功率循环下键合引线的疲劳寿命,提高IGBT模块的可靠性,文中提出了一种基于壳温的键合引线寿命预测方法。首先对IGBT模块进行功率循环测试,探究了键合引线的疲劳失效机理;然后建立IGBT模块的电—热—结构强耦合模型,分析了模块在功率循环载荷下的电、热、结构特性。依据键合引线的应变情况和实验测得的疲劳曲线,评估键合引线的疲劳寿命,并在壳温基础上建立了其寿命预测模型,对比测试结果验证了该模型的准确性;最后提出了铜键合引线的改进方案。根据易测量的壳温来确定键合引线的使用寿命,提前更换器件,能降低IGBT模块的故障率。
[Abstract]:In order to study the fatigue life of bonding lead under power cycle and improve the reliability of IGBT module, a method for predicting the life of bonding lead based on shell temperature is proposed in this paper. The fatigue failure mechanism of the bonding lead is investigated by testing the power cycle of the IGBT module, and then the electric-thermal-structural strong coupling model of the IGBT module is established, and the electrical, thermal and structural characteristics of the module under the power cycle load are analyzed. According to the strain of bond lead and the fatigue curve measured by experiment, the fatigue life of bond lead is evaluated, and the prediction model of its life is established on the basis of shell temperature. The accuracy of the model is verified by comparing the test results. Finally, the improvement scheme of copper bonding lead is put forward. The failure rate of IGBT module can be reduced by determining the service life of bonding lead and changing the device in advance according to the easily measured shell temperature.
【作者单位】： 三峡大学电气与新能源学院;雅砻江流域水电开发有限公司;国网安徽省电力公司马鞍山供电公司;
【分类号】：TN322.8
[Abstract]:In order to study the fatigue life of bonding lead under power cycle and improve the reliability of IGBT module, a method for predicting the life of bonding lead based on shell temperature is proposed in this paper. The fatigue failure mechanism of the bonding lead is investigated by testing the power cycle of the IGBT module, and then the electric-thermal-structural strong coupling model of the IGBT module is established, and the electrical, thermal and structural characteristics of the module under the power cycle load are analyzed. According to the strain of bond lead and the fatigue curve measured by experiment, the fatigue life of bond lead is evaluated, and the prediction model of its life is established on the basis of shell temperature. The accuracy of the model is verified by comparing the test results. Finally, the improvement scheme of copper bonding lead is put forward. The failure rate of IGBT module can be reduced by determining the service life of bonding lead and changing the device in advance according to the easily measured shell temperature.
【作者单位】： 三峡大学电气与新能源学院;雅砻江流域水电开发有限公司;国网安徽省电力公司马鞍山供电公司;
【分类号】：TN322.8
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