基于多层PCB的三维频率选择表面研究
发布时间：2018-11-21 17:19
【摘要】：频率选择表面(Frequency selective surface,FSS)作为一种空间滤波器,对不同工作频率、入射角度和极化状态的电磁波具有选择滤波特性,因而广泛应用于天线与微波系统。由于传统二维FSS谐振方式有限,只能展现较差的选择滤波性能,越来越难满足现代微波与通信系统对FSS的性能需求。近年来,基于腔体单元结构的三维FSS可产生多模谐振,实现较好的滤波性能,而受到广泛关注。然而,大部分三维FSS结构复杂、加工难度大,不利于其在高频段的应用。本论文深入研究了一类高性能三维FSS的谐振模式和等效电路,并基于传统多层印刷电路工艺进行改进设计和加工,较大程度上降低了三维FSS设计和加工难度,拓宽了三维FSS的应用范围。具体研究内容如下:(1)简要分析了传统二维FSS的工作机理以及等效电路。并以方环阵列为例,介绍了二维FSS等效电路参数经典提取方法。以此为基础,介绍了三维FSS的广义等效电路模型。进一步以一种层叠微带线阵列(三维结构)为例,详细分析了其工作机理,建立了等效电路模型,研究了一种提取该类型三维FSS等效电路参数的新方法。(2)基于层叠微带线阵列,设计了一个高选择性带通三维FSS。分析了产生高选择性的工作机理,建立了等效电路模型,提取了等效电路参数。进一步,基于多层PCB工艺和金属化过孔技术,对该FSS进行改进,使之可工作于K-Ka波段。最后,设计加工了一个工作于25.3GHz的高频率选择性FSS,测试与仿真结果吻合良好。(3)基于阶跃阻抗谐振器(Stepped impedance resonator,SIR),改进了层叠微带线阵列,设计了一个宽阻带三维FSS。该FSS在低频(f0=3.9GHz)拥有一个通带,S21低于-20d B的带宽为[2f0-8f0(7.7GHz-32.7GHz)]。建立了该FSS的等效电路模型,提取了等效电路参数。最后,基于多层PCB工艺对该FSS改进设计,对比分析了多层化改进前后结构的工作性能。(4)以SIR与均匀阻抗谐振器(Uniform impedance resonator,UIR)为基础,设计了一种具有三条传输通道的三频三维FSS。该FSS的每个工作频带都由不同的传输通道产生,通带内的传输极点也分别由不同的谐振器产生,因此该FSS的工作频率具有独立可控的优点。进一步,利用多层PCB工艺将三维结构多层化,实现了基于多层PCB的三频带通FSS,大大降低了加工难度。为了实验验证,设计了一个工作于4、6.8、11.3GHz的三频FSS,并进行了加工测试,测试与仿真结果吻合良好。
[Abstract]:As a spatial filter, FSS (Frequency selective Surface) (Frequency selective surface,FSS) is widely used in antenna and microwave systems because of its selective filtering properties for electromagnetic waves with different operating frequencies, incident angles and polarization states. Due to the limited resonance mode of traditional two-dimensional FSS, it can only exhibit poor selective filtering performance, and it is becoming more and more difficult to meet the performance requirements of FSS in modern microwave and communication systems. In recent years, 3D FSS based on cavity unit structure can generate multi-mode resonance and achieve better filtering performance. However, the structure of most 3D FSS is complex and difficult to process, which is not conducive to its application in high frequency band. In this paper, the resonant mode and equivalent circuit of a kind of high performance 3D FSS are deeply studied, and the design and processing of 3D FSS are improved based on the traditional multi-layer printing circuit technology, which greatly reduces the difficulty of designing and machining 3D FSS. The application range of 3D FSS is widened. The main contents are as follows: (1) the working mechanism and equivalent circuit of traditional two-dimensional FSS are briefly analyzed. Taking square ring array as an example, the classical extraction method of two-dimensional FSS equivalent circuit parameters is introduced. Based on this, the generalized equivalent circuit model of 3D FSS is introduced. Taking a laminated microstrip array (3D structure) as an example, the working mechanism is analyzed in detail, and the equivalent circuit model is established. A new method for extracting the equivalent circuit parameters of this type of 3D FSS is studied. (2) based on the stacked microstrip line array, a highly selective band-pass 3D FSS. is designed. The working mechanism of high selectivity is analyzed, the equivalent circuit model is established and the equivalent circuit parameters are extracted. Furthermore, based on the multilayer PCB process and metallized perforation technology, the FSS is improved to work in the K-Ka band. Finally, a high frequency selective FSS, test based on 25.3GHz is designed and fabricated. (3) based on step impedance resonator (Stepped impedance resonator,SIR), the stacked microstrip array is improved. A wide stopband 3D FSS. is designed. The FSS has a passband at low frequency (f0=3.9GHz), and the bandwidth of S21 below -20dB is [2f0-8f0 (7.7GHz-32.7GHz)]. The equivalent circuit model of the FSS is established and the equivalent circuit parameters are extracted. Finally, the improved design of the FSS based on multilayer PCB process is compared and analyzed. (4) based on SIR and uniform impedance resonator (Uniform impedance resonator,UIR), the performance of the structure before and after the multilayer improvement is compared and analyzed. A three-frequency three-dimensional FSS. with three transmission channels is designed. Each frequency band of the FSS is generated by different transmission channels, and the transmission poles in the passband are generated by different resonators respectively. Therefore, the operating frequency of the FSS has the advantage of independent and controllable. Furthermore, the multi-layer PCB process is used to multilayer the 3D structure, and the three-band pass-through FSS, based on multi-layer PCB is realized, which greatly reduces the processing difficulty. For the purpose of experimental verification, a tri-frequency FSS, working at 46.8GHz and 11.3GHz has been designed and tested. The test results are in good agreement with the simulation results.
【学位授予单位】：南京邮电大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TN713
本文编号：2347678
[Abstract]:As a spatial filter, FSS (Frequency selective Surface) (Frequency selective surface,FSS) is widely used in antenna and microwave systems because of its selective filtering properties for electromagnetic waves with different operating frequencies, incident angles and polarization states. Due to the limited resonance mode of traditional two-dimensional FSS, it can only exhibit poor selective filtering performance, and it is becoming more and more difficult to meet the performance requirements of FSS in modern microwave and communication systems. In recent years, 3D FSS based on cavity unit structure can generate multi-mode resonance and achieve better filtering performance. However, the structure of most 3D FSS is complex and difficult to process, which is not conducive to its application in high frequency band. In this paper, the resonant mode and equivalent circuit of a kind of high performance 3D FSS are deeply studied, and the design and processing of 3D FSS are improved based on the traditional multi-layer printing circuit technology, which greatly reduces the difficulty of designing and machining 3D FSS. The application range of 3D FSS is widened. The main contents are as follows: (1) the working mechanism and equivalent circuit of traditional two-dimensional FSS are briefly analyzed. Taking square ring array as an example, the classical extraction method of two-dimensional FSS equivalent circuit parameters is introduced. Based on this, the generalized equivalent circuit model of 3D FSS is introduced. Taking a laminated microstrip array (3D structure) as an example, the working mechanism is analyzed in detail, and the equivalent circuit model is established. A new method for extracting the equivalent circuit parameters of this type of 3D FSS is studied. (2) based on the stacked microstrip line array, a highly selective band-pass 3D FSS. is designed. The working mechanism of high selectivity is analyzed, the equivalent circuit model is established and the equivalent circuit parameters are extracted. Furthermore, based on the multilayer PCB process and metallized perforation technology, the FSS is improved to work in the K-Ka band. Finally, a high frequency selective FSS, test based on 25.3GHz is designed and fabricated. (3) based on step impedance resonator (Stepped impedance resonator,SIR), the stacked microstrip array is improved. A wide stopband 3D FSS. is designed. The FSS has a passband at low frequency (f0=3.9GHz), and the bandwidth of S21 below -20dB is [2f0-8f0 (7.7GHz-32.7GHz)]. The equivalent circuit model of the FSS is established and the equivalent circuit parameters are extracted. Finally, the improved design of the FSS based on multilayer PCB process is compared and analyzed. (4) based on SIR and uniform impedance resonator (Uniform impedance resonator,UIR), the performance of the structure before and after the multilayer improvement is compared and analyzed. A three-frequency three-dimensional FSS. with three transmission channels is designed. Each frequency band of the FSS is generated by different transmission channels, and the transmission poles in the passband are generated by different resonators respectively. Therefore, the operating frequency of the FSS has the advantage of independent and controllable. Furthermore, the multi-layer PCB process is used to multilayer the 3D structure, and the three-band pass-through FSS, based on multi-layer PCB is realized, which greatly reduces the processing difficulty. For the purpose of experimental verification, a tri-frequency FSS, working at 46.8GHz and 11.3GHz has been designed and tested. The test results are in good agreement with the simulation results.
【学位授予单位】：南京邮电大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TN713
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1 王秀芝;小型化频率选择表面研究[D];中国科学院研究生院(长春光学精密机械与物理研究所);2014年
2 左钰;新型三维频率选择结构的研究[D];南京大学;2013年
相关硕士学位论文 前1条
1 何显宗;毫米波带通频率选择表面研究[D];长春理工大学;2008年
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