混合集成电路气密性封装随机振动仿真及可靠性优化设计
发布时间：2018-11-27 10:43
【摘要】：混合集成电路(Hybrid integrated circuit,HIC)以小体积、高密度、高功率、高可靠性等特点而在宇航和军用设备、汽车电子、家用电器等领域获得了广泛应用;其中金属气密性封装结构可起到隔绝空气中的氧气、水汽及其它腐蚀介质的作用;但在HIC金属气密性封装结构服役过程中,经常发生由于振动载荷导致的盖板开裂而引起HIC失效的情况。对HIC金属气密性封装结构在随机振动载荷下的失效问题,目前国内尚少见相关研究工作。本文针对HIC金属气密性封装结构进行模态分析和随机振动分析,通过数值计算的方法获得封装盖板在给定载荷下的振动疲劳寿命,并对金属封装结构进行了可靠性优化设计。本文研究中首先通过系统查阅相关资料和测量样品尺寸,建立了HIC金属封装组件的三维有限元模型,并利用数值计算方法完成了对封装组件的模态分析和随机振动分析;随后通过模态试验和随机振动试验对已获得的模态数据和随机振动响应数据进行验证;然后在模拟计算和试验研究获得数据结果一致的前提下,获取封装结构危险点处的应力响应功率谱密度(Power spectral density,PSD),利用反傅里叶变换将其转化为时域的载荷-时间数据;最后结合雨流计数法、可伐合金的疲劳曲线(S-N曲线)、Miner线性损伤累积理论完成封装结构的振动疲劳寿命计算,其中通过数值计算得到的封装结构在给定振动载荷下的疲劳寿命为496小时。在完成封装结构的疲劳寿命计算之后,对影响其疲劳失效的因素进行研究,分别从应力集中、构件表面状态、几何尺寸、构件测试及服役环境等方面进行分析,并对盖板振动开裂的机理进行探讨。封装结构的抗振可靠性优化设计主要从两个方面进行。一是基于平行缝焊的焊缝宽度确定其对封装结构第一阶模态固有频率的影响,计算结果表明当焊缝宽度超过临界值时可以避免封装结构在20~2000Hz范围的振动载荷下出现共振;在确定了焊缝临界宽度值后,可以通过优化平行缝焊工艺来实现避免结构共振这一目标。优化设计的另一方面是基于盖板厚度分布对封装结构在振动载荷下应力响应的影响,通过模拟方法获得了盖板厚度分布对盖板应力响应的作用规律;模拟结果表明,在满足工艺条件的前提下应尽可能加厚盖板的边缘厚度,减薄盖板的下部厚度,这样可以有效降低盖板的应力响应值,从而减小振动应力造成的损伤,提高封装结构在随机振动载荷下的可靠性。
[Abstract]:Hybrid integrated circuit (Hybrid integrated circuit,HIC) has been widely used in aerospace, military equipment, automotive electronics, home appliances and other fields because of its small volume, high density, high power and high reliability. The metal airtight packaging structure can insulate the oxygen, water vapor and other corrosive media in the air. However, during the service of HIC metal airtight packaging structure, the failure of HIC often occurs due to the crack of the cover plate caused by vibration load. At present, there are few researches on the failure of HIC metal airtight packaging under random vibration load. In this paper, modal analysis and random vibration analysis are carried out for HIC metal airtight packaging structure. The vibration fatigue life of the seal plate under a given load is obtained by numerical calculation, and the reliability optimization design of the metal seal structure is carried out. In this paper, the three-dimensional finite element model of HIC metal packaging assembly is established by consulting the relevant data and measuring the sample size systematically, and the modal analysis and random vibration analysis of the package assembly are completed by using the numerical calculation method. Then the obtained modal data and random vibration response data are verified by modal test and random vibration test. Then the stress response power spectral density (Power spectral density,PSD) at the dangerous point of the package structure is obtained on the premise that the simulation results are consistent with the experimental results, and the time-domain load-time data are transformed by inverse Fourier transform. Finally, the fatigue life of package structure is calculated by), Miner linear damage accumulation theory of S-N curve and rain-flow counting method. The fatigue life of the encapsulated structure under the given vibration load is 496 hours. After the fatigue life calculation of the package structure is finished, the factors that affect the fatigue failure of the package structure are studied, and the stress concentration, the surface state of the component, the geometric dimension, the testing of the component and the service environment are analyzed respectively. The mechanism of vibration cracking of cover plate is discussed. The optimum design of the anti-vibration reliability of the package structure is mainly carried out from two aspects. First, the influence of weld width of parallel seam welding on the first mode natural frequency of packaging structure is determined. The results show that the resonance of package structure under the vibration load of 20~2000Hz range can be avoided when the weld width exceeds the critical value. After determining the critical width of weld, the goal of avoiding structural resonance can be achieved by optimizing the parallel seam welding process. On the other hand, the optimum design is based on the influence of the thickness distribution of the cover plate on the stress response of the package structure under the vibration load. The effect of the thickness distribution of the cover plate on the stress response of the cover plate is obtained by the simulation method. The simulation results show that the edge thickness of the cover plate should be thickened as much as possible and the thickness of the lower part of the cover plate should be thinned under the premise of satisfying the technological conditions, which can effectively reduce the stress response value of the cover plate and reduce the damage caused by vibration stress. The reliability of packaging structure under random vibration load is improved.
【学位授予单位】：华南理工大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN45
本文编号：2360469
[Abstract]:Hybrid integrated circuit (Hybrid integrated circuit,HIC) has been widely used in aerospace, military equipment, automotive electronics, home appliances and other fields because of its small volume, high density, high power and high reliability. The metal airtight packaging structure can insulate the oxygen, water vapor and other corrosive media in the air. However, during the service of HIC metal airtight packaging structure, the failure of HIC often occurs due to the crack of the cover plate caused by vibration load. At present, there are few researches on the failure of HIC metal airtight packaging under random vibration load. In this paper, modal analysis and random vibration analysis are carried out for HIC metal airtight packaging structure. The vibration fatigue life of the seal plate under a given load is obtained by numerical calculation, and the reliability optimization design of the metal seal structure is carried out. In this paper, the three-dimensional finite element model of HIC metal packaging assembly is established by consulting the relevant data and measuring the sample size systematically, and the modal analysis and random vibration analysis of the package assembly are completed by using the numerical calculation method. Then the obtained modal data and random vibration response data are verified by modal test and random vibration test. Then the stress response power spectral density (Power spectral density,PSD) at the dangerous point of the package structure is obtained on the premise that the simulation results are consistent with the experimental results, and the time-domain load-time data are transformed by inverse Fourier transform. Finally, the fatigue life of package structure is calculated by), Miner linear damage accumulation theory of S-N curve and rain-flow counting method. The fatigue life of the encapsulated structure under the given vibration load is 496 hours. After the fatigue life calculation of the package structure is finished, the factors that affect the fatigue failure of the package structure are studied, and the stress concentration, the surface state of the component, the geometric dimension, the testing of the component and the service environment are analyzed respectively. The mechanism of vibration cracking of cover plate is discussed. The optimum design of the anti-vibration reliability of the package structure is mainly carried out from two aspects. First, the influence of weld width of parallel seam welding on the first mode natural frequency of packaging structure is determined. The results show that the resonance of package structure under the vibration load of 20~2000Hz range can be avoided when the weld width exceeds the critical value. After determining the critical width of weld, the goal of avoiding structural resonance can be achieved by optimizing the parallel seam welding process. On the other hand, the optimum design is based on the influence of the thickness distribution of the cover plate on the stress response of the package structure under the vibration load. The effect of the thickness distribution of the cover plate on the stress response of the cover plate is obtained by the simulation method. The simulation results show that the edge thickness of the cover plate should be thickened as much as possible and the thickness of the lower part of the cover plate should be thinned under the premise of satisfying the technological conditions, which can effectively reduce the stress response value of the cover plate and reduce the damage caused by vibration stress. The reliability of packaging structure under random vibration load is improved.
【学位授予单位】：华南理工大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN45
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