光TSV损耗特性与耦合特性的研究
[Abstract]:TSV (Through-Silicon Vias, silicon perforation) technology can significantly reduce the length of wires between chip layers, so it has become the core technology of 3D integrated circuit technology. Optical TSV has the advantages of both optical waveguide and electric TSV. Compared with electric TSV, optical TSV has more bandwidth, less parasitic effect and stronger anti-jamming ability. Therefore, optical TSV has become another new area of 3D integration technology. The loss characteristics of optical TSV are significantly affected by such factors as core diameter, longitudinal height and light source wavelength. In addition, the optical TSV is based on the TSV process, so the defects caused by the TSV process will also affect the performance of the optical TSV. In order to improve the integration of optical TSV as much as possible, the distance between optical TSV should be as small as possible. However, when the spacing between TSV decreases, the coupling effect between optical TSV will increase. In this paper, RSOFT software is used to study the loss and coupling characteristics of optical TSV. In the aspect of loss characteristics of optical TSV, the influence of optical TSV structure parameters and light source wavelength on the loss characteristics is studied in this paper. The simulation results show that the transmission loss of optical TSV decreases with the increase of core diameter and increases with the increase of light source wavelength and longitudinal height. Secondly, the loss characteristics of optical TSV under different side-wall conditions are studied. The results show that the higher the side wall is, the greater the transmission loss of TSV is, and the loss degree is related to the selection of the incident end face, the transmission loss of light TSV with rough side wall is higher than that with smooth side wall light TSV. For the light TSV whose sidewall is rough and inclined, the effect of sidewall roughness on the transmission loss of optical TSV is less than that of sidewall inclination. In terms of the coupling characteristics of optical TSV, the influence of the spacing between adjacent optical TSV on the coupling characteristics is studied in this paper. The simulation results show that the coupling effect of two adjacent TSV decreases with the increase of their spatial distance. Secondly, the coupling characteristics of optical TSV under different side-wall conditions are studied. The results show that the coupling effect of smooth light TSV is smaller than that of rough type light TSV, and the coupling effect of smooth light TSV is much smaller than that of rough type light TSV. The coupling effect of the side-wall tilted TSV on the adjacent light TSV is greater than that of the positive incident side-wall tilted light TSV. The light TSV with the rough type is all concave and has more coupling effect on the adjacent light TSV than the light TSV with the rough type all protruding. The coupling effect of the TSV on the adjacent optical TSV is larger than that of the TSV with the rough oblique side wall on the positive incident side wall, and the coupling effect of the optical TSV on the adjacent optical TSV is larger than that on the side wall with the opposite incidence. The combined effect of the rough side wall and the positive incident mode increases the coupling effect of the coarse oblique optical TSV on the adjacent optical TSV.
【学位授予单位】:西安电子科技大学
【学位级别】:硕士
【学位授予年份】:2015
【分类号】:TN40;TP319
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