基于田口法的高密度倒装微铜柱凸点热失效分析
发布时间：2018-12-17 00:34
【摘要】：采用有限元模拟法,分析在热循环载荷条件下高密度倒装芯片封装微铜柱凸点的失效行为,并以微铜柱凸点的最大累积塑性应变能密度作为响应,采用3因素3水平的田口正交试验法分析倒装芯片封装的主要结构参数和材料属性对其热失效行为的影响.结果表明,距离封装中心最远处的微铜柱凸点是封装体中的关键微凸点,热疲劳导致的裂纹易在该微铜柱凸点的基板侧焊料外侧形成.底部填充胶的线膨胀系数对微铜柱凸点热失效的影响最大,影响适中的是底部填充胶的弹性模量,最弱的是芯片厚度.
[Abstract]:In this paper, the finite element simulation method is used to analyze the failure behavior of the convex points of microcopper columns encapsulated by high density inverted chips under thermal cyclic loading, and the maximum cumulative plastic strain energy density of the convex points of copper columns is taken as the response. The influence of main structure parameters and material properties on thermal failure behavior of inverted chip packaging was analyzed by using three factors and three levels of Taguchi orthogonal test method. The results show that the convex spot of the micro-copper column is the key microconvex spot in the package, and the crack caused by thermal fatigue is easily formed outside the side solder of the convex spot of the micro-copper column. The linear expansion coefficient of the bottom filling adhesive has the greatest influence on the thermal failure of the convex spot of the micro-copper column. The moderate effect is the elastic modulus of the bottom filled adhesive and the weakest is the chip thickness.
【作者单位】： 河南工业大学机电工程学院;华中科技大学武汉光电国家实验室;
【基金】：国家自然科学基金资助项目(U1504507) 河南省科技攻关资助项目(162102410018) 河南省高等学校重点科研项目计划(17H130004)
【分类号】：TN405
本文编号：2383322
[Abstract]:In this paper, the finite element simulation method is used to analyze the failure behavior of the convex points of microcopper columns encapsulated by high density inverted chips under thermal cyclic loading, and the maximum cumulative plastic strain energy density of the convex points of copper columns is taken as the response. The influence of main structure parameters and material properties on thermal failure behavior of inverted chip packaging was analyzed by using three factors and three levels of Taguchi orthogonal test method. The results show that the convex spot of the micro-copper column is the key microconvex spot in the package, and the crack caused by thermal fatigue is easily formed outside the side solder of the convex spot of the micro-copper column. The linear expansion coefficient of the bottom filling adhesive has the greatest influence on the thermal failure of the convex spot of the micro-copper column. The moderate effect is the elastic modulus of the bottom filled adhesive and the weakest is the chip thickness.
【作者单位】： 河南工业大学机电工程学院;华中科技大学武汉光电国家实验室;
【基金】：国家自然科学基金资助项目(U1504507) 河南省科技攻关资助项目(162102410018) 河南省高等学校重点科研项目计划(17H130004)
【分类号】：TN405
【相似文献】
相关期刊论文 前3条
1 张超;孔德仁;贾云飞;;基于自适应加权融合的标准铜柱鉴选研究[J];电子测量技术;2010年07期
2 王燕杰;李青;;涡流法检测铜柱高度[J];工业控制计算机;2013年06期
3 ;[J];;年期
相关重要报纸文章 前1条
1 ;隐形斗篷：能把一个铜柱变“没”了[N];新华每日电讯;2006年
相关硕士学位论文 前5条
1 江伟;基于TSV的铜柱应力分析及结构优化[D];哈尔滨理工大学;2016年
2 孙帅飞;静标铜柱高低温校准装置及修正方法研究[D];南京理工大学;2013年
3 刘冰冰;测压铜柱静态标定体制的研究[D];南京理工大学;2009年
4 曹程良;基于铜柱凸块覆晶技术的移动装置处理芯片封装工艺创新研究[D];复旦大学;2012年
5 韩成辉;测压铜柱静态及动态力学特性分析[D];南京理工大学;2008年
，本文编号：2383322
本文链接：https://www.wllwen.com/kejilunwen/dianzigongchenglunwen/2383322.html
