微系统三维集成技术的新发展
发布时间：2019-01-30 10:59
【摘要】：进入新世纪,微电子的发展进入纳电子/集成微系统时代,人们在继续发展摩尔定律的同时,创新了超越摩尔定律的微系统三维集成技术。介绍了在成像传感、光集成微系统、惯性传感微系统、射频微系统、生物微系统和逻辑微系统的三维集成技术的新发展,包含MEMS和IC的3D异构集成、具有Si插入器的SiP3D集成和异质3D集成等技术和各自相应的特点,以及在各应用领域所产生的革命性成果。还介绍了微系统三维集成中有关TSV的可靠性研究的最新进展。
[Abstract]:In the new century, the development of microelectronics has entered the era of nanoelectronics / integrated microsystems. While people continue to develop Moore's law, they have innovated the three-dimensional integration technology of microsystems beyond Moore's law. This paper introduces the development of 3D integration technology in imaging sensing, optical integrated microsystems, inertial sensing microsystems, RF microsystems, biological microsystems and logical microsystems, including 3D heterogeneous integration of MEMS and IC. The technology of SiP3D integration and heterogeneous 3D integration with Si inserters and their respective characteristics, as well as the revolutionary achievements in various application fields. The latest research progress of TSV reliability in micro-system three-dimensional integration is also introduced.
【作者单位】： 中国电子科技集团公司;专用集成电路重点实验室;
【分类号】：TN409
本文编号：2418060
[Abstract]:In the new century, the development of microelectronics has entered the era of nanoelectronics / integrated microsystems. While people continue to develop Moore's law, they have innovated the three-dimensional integration technology of microsystems beyond Moore's law. This paper introduces the development of 3D integration technology in imaging sensing, optical integrated microsystems, inertial sensing microsystems, RF microsystems, biological microsystems and logical microsystems, including 3D heterogeneous integration of MEMS and IC. The technology of SiP3D integration and heterogeneous 3D integration with Si inserters and their respective characteristics, as well as the revolutionary achievements in various application fields. The latest research progress of TSV reliability in micro-system three-dimensional integration is also introduced.
【作者单位】： 中国电子科技集团公司;专用集成电路重点实验室;
【分类号】：TN409
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2 张光照;微系统技术及其应用[J];世界电子元器件;1997年08期
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