荧光粉沉降导致的白光LED色温漂移及其解决办法
[Abstract]:White LED is widely used in display and lighting field because of its advantages of high efficiency and energy saving, long life and green environment. The combination of blue LED chip and yellow phosphor is the most important white light LED realization form. In the process of dispensing and baking in white LED packaging process, the phosphors will produce obvious deposition, which will lead to the serious drift of white LED color temperature and the inconsistent photochromic properties of the products. In order to study this phenomenon, a real-time measurement system of white LED spectrum is designed, and the deposition state of phosphors in SMD type white LED packaging structure is observed cross-section, which explains the influence of phosphor deposition on the color temperature of white LED. On this basis, several methods to solve the problem of color temperature drift are tried, and it is found that the scattering particles with light density are mixed in the phosphor gel. It can effectively solve the problem of color temperature drift caused by phosphor deposition. 1) the real-time measurement system of white LED spectrum is designed and fabricated. The relationship between the phenomenon of phosphor deposition and the color temperature of white LED is studied. The results show that the deposition of phosphors will decrease the intensity of blue light in white LED spectrum and increase the intensity of yellow light, which will lead to the decrease of color temperature. In this paper, it is concluded that the deposition of phosphors will lead to the change of their distribution in the encapsulated adhesive. During the deposition and aggregation of the phosphors, the transmittance of the phosphors decreases, the reflectivity increases, and the backscattering / reflectance of the phosphors increases. Blue light produced more yellow light and blue yellow conversion rate by multiple reflection between the reflector layer and phosphor layer, and the color temperature decreased gradually. 2) The addition of appropriate amount of Si02 scattering particles or the use of fine particle size phosphors can reduce the color temperature drift caused by deposition to a certain extent, but all of them have a great effect on the initial brightness of white LED. In this paper, we try to add hollow glass beads with light density and suitable diameter to fluorescent adhesive, which will float up gradually in encapsulation adhesive, and the backscattering / reflection degree of fluorescent beads will decrease gradually, which is contrary to the effect of phosphor deposition on light scattering. The incorporation of hollow beads can basically eliminate the color temperature change in the sedimentation process, and has little effect on the initial brightness. 3) in this paper, the cross section sections of SMD type white light LED are made by using transparent silicone resin mosaic method. The deposition of phosphors in SMD type white LED was studied. It is found that due to the height of the blue LED chip, some phosphors will sink below the surface of the LED chip, resulting in lateral leakage of light, thus increasing the blue emission. The color temperature is raised. 4) the SMD type white light LED is pre-padded and the fine hollow glass beads are added into the phosphor to alleviate the phenomenon of color temperature drift caused by the deposition process of the phosphor. The practical SMD package test shows that the process has good application effect.
【学位授予单位】:东南大学
【学位级别】:硕士
【学位授予年份】:2015
【分类号】:TN104.3;TN312.8;TQ422
【参考文献】
相关期刊论文 前10条
1 陈云霞;;LED封装过程中出现若干问题的探讨[J];硅谷;2014年16期
2 李俊生;赵琳;孙晶;郭瑞红;;对丁达尔效应的研究[J];化学教学;2014年01期
3 韩絮;孙阳昭;吴建民;王祖光;方莉;;科学看待荧光灯推广过程中的汞污染问题[J];环境保护与循环经济;2013年05期
4 沈立;;LED,向白炽灯Say Good Night[J];环境;2013年04期
5 牟秋红;刘月涛;彭丹;李金辉;王林;张敏;;LED封装用甲基苯基有机硅材料的性能研究[J];有机硅材料;2013年01期
6 董向坤;杜晓晴;钟广明;唐杰灵;陈伟民;;GaN基倒装焊LED芯片的热学特性模拟与分析[J];光电子技术;2012年02期
7 高南;刘伟区;闫振龙;孙越;陈海生;;功率型LED封装用高分子材料的研究进展[J];广州化学;2012年02期
8 郑智斌;;LED环氧灌封工艺对其可靠性的影响[J];半导体技术;2012年06期
9 刘荣辉;何华强;黄小卫;胡运生;刘元红;庄卫东;;白光LED荧光粉研究及应用新进展[J];半导体技术;2012年03期
10 宋国华;缪建文;姜斌;郁幸超;;近紫外芯片激发三基色荧光粉制作的白光LED[J];半导体技术;2011年08期
相关博士学位论文 前1条
1 刘宗源;大功率LED封装设计与制造的关键问题研究[D];华中科技大学;2010年
相关硕士学位论文 前10条
1 李威;LED背光液晶电视色彩一致性的研究[D];山东大学;2013年
2 詹钰君;大功率白光LED荧光粉测试系统的设计与实现[D];武汉理工大学;2012年
3 曹宇杰;高显色指数高光效LED球泡灯的研究[D];中国计量学院;2012年
4 陈丽;大功率白光LED光源集成封装技术研究[D];华南理工大学;2011年
5 冯瀚;荧光粉沉降问题对LED光学一致性的影响[D];华中科技大学;2011年
6 杨传超;大功率LED多芯片模块散热器设计与封装结构热阻分析[D];哈尔滨工业大学;2010年
7 肖友鹏;Si衬底GaN基功率型LED芯片性能研究[D];南昌大学;2010年
8 杨柳滨;LED芯片工艺参数分析测试技术的研究[D];复旦大学;2009年
9 苏达;大功率LED封装散热性能的若干问题研究[D];浙江大学;2008年
10 陈乐君;基于快速光谱分析测试系统的研究[D];浙江大学;2006年
,本文编号:2419030
本文链接:https://www.wllwen.com/kejilunwen/dianzigongchenglunwen/2419030.html