超声电铸提高金属微流控芯片模具的均匀性

发布时间：2019-02-15 21:20

【摘要】：利用微电铸技术制作的微流控芯片模具往往存在沉积厚度不均匀的缺陷,这种缺陷会影响模具的尺寸精度及使用性能,并增加模具的制作成本。为了制得厚度均匀的微流控芯片模具,研究了超声电铸对模具均匀性的影响。首先,采用有限元软件COMSOL Multiphysics建立微流控芯片模具的微电铸模型,分析电铸2h后的模具的厚度分布。并根据该仿真结果,设计掩模版。然后,在自主搭建的超声电铸装置中进行一系列电铸实验,来研究超声搅拌对模具均匀性的影响。实验结果表明:电铸过程中添加超声搅拌可以改善微流控芯片模具的均匀性。超声功率为200 W时,超声频率改善模具均匀性的程度为200kHz80kHz120kHz。超声频率为200kHz时,超声功率改善模具均匀性的程度为500 W200 W100 W。当超声的频率和功率分别为200kHz和500 W时,与无超声电铸相比,模具的均匀性提高约30%。
[Abstract]:The microfluidic chip die made by microelectroforming technology often has the defect of uneven deposition thickness, which will affect the dimensional accuracy and performance of the die, and increase the cost of making the die. The influence of ultrasonic electroforming on the uniformity of microfluidic chip die was studied. Firstly, the microelectroforming model of microfluidic chip die was established by finite element software COMSOL Multiphysics, and the thickness distribution of the die was analyzed after 2 hours of electroforming. According to the simulation results, the mask plate is designed. Then, a series of electroforming experiments were carried out to study the influence of ultrasonic stirring on the uniformity of die. The experimental results show that the uniformity of microfluidic chip dies can be improved by adding ultrasonic stirring in electroforming process. When the ultrasonic power is 200 W, the degree of improving the uniformity of mould by ultrasonic frequency is 200 kHz 80 kHz 120 kHz. When ultrasonic frequency is 200kHz, the degree of improving die uniformity by ultrasonic power is 500 W 200 W 100 W. When the frequency and power of ultrasonic are 200kHz and 500W respectively, the uniformity of the die is increased by about 300.compared with the non-ultrasonic electroforming.
【作者单位】：大连理工大学精密与特种加工教育部重点实验室;大连理工大学辽宁省微纳米及系统重点实验室;博奥生物有限公司;
【基金】：国家自然科学基金项目(51375077) 国家高技术发展计划项目(2012AA040406)
【分类号】：TN492

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