分布式大功率LED组件热场分析与优化设计

发布时间：2019-02-24 13:31

【摘要】：大功率LED以其节能高效、使用寿命长和较高的安全性越来越广泛的跻身于照明领域，作为绿色光源，其优势不言而喻。特别是近年来国家对半导体照明的大力扶持和推动，使其更普遍的被大众所接受，但LED照明被作为新兴光源在准备逐步替代传统光源的同时也被要求增加更大的功率以满足市场需求。因此，散热问题成为限制大功率LED发展的重要因素。其中，分布式大功率LED作为LED照明面光源的代表对其热场的分析研究尤为重要，分布式大功率LED以其灵活的布光和结构在LED市场上占有不可替代的位置，而因其独有的布局结构形成了较普通LED组件更为复杂的热场，其散热问题急需解决。本课题就是以分析分布式大功率LED的散热问题作为切入点，，通过分析与研究分布式大功率LED灯具的组件结构的热场，优化大功率LED灯具整体结构，均化分布式大功率LED各个芯片结点温度，快速地散发掉由LED光源芯片产生的大量的热量，进而有效地改善其散热，为提高分布式大功率LED照明性能给出理论依据。本文对分布式大功率LED在国内外的发展状况进行了分析和概述，提出了通过以优化分布式大功率LED组件结构来均化热场温度并加强散热。通过数学描述来分析研究LED散热问题产生的根源，以明确的研究目的开展研究内容，提出了分布式大功率LED存在热耦合的概念，进而芯片进行详尽的热分析，建立完整的热学模型，进行理论分析与比较。其次，通过采用热电偶的测量方法对组件温度进行采集，利用正交分析对分布式大功率LED灯具的散热器主要影响散热的各个因素进行单一的散热性能分析与研究，并分别对热沉尺寸、肋片厚度、肋片高度、肋片间距等等一系列因素与LED芯片结温的变化关系来绘制曲线，清晰的反应了各个因素对LED芯片结温的影响。最后，通过利用有限元热仿真对优化结果进行模拟仿真，使本文提出的优化方向的对减弱热场的热耦合和对散热的增强更加清晰明确。
[Abstract]:High power LED is more and more widely used in the field of lighting because of its energy-saving efficiency, long service life and high security. As a green light source, its advantages are self-evident. In particular, in recent years, the state has made great efforts to support and promote semiconductor lighting, making it more generally accepted by the public. However, as a new light source, LED lighting is expected to gradually replace the traditional light source, and it is also required to increase the power to meet the market demand. Therefore, the problem of heat dissipation has become an important factor limiting the development of high-power LED. It is particularly important to analyze the thermal field of distributed high power LED as the representative of LED illumination surface light source. Distributed high power LED occupies an irreplaceable position in the LED market with its flexible light distribution and structure. Because of its unique layout structure, the heat field is more complex than the common LED component, so the heat dissipation problem needs to be solved urgently. This subject is to analyze the heat dissipation of distributed high-power LED as a breakthrough point, through the analysis and study of the thermal field of the component structure of distributed high-power LED lamps and lanterns, optimize the overall structure of high-power LED lamps and lanterns. The distributed high power LED chip node temperature is homogenized, and the large amount of heat generated by the LED light source chip is rapidly emitted, thus effectively improving its heat dissipation, which provides a theoretical basis for improving the lighting performance of the distributed high power LED. In this paper, the development of distributed high power LED at home and abroad is analyzed and summarized, and it is proposed to homogenize the thermal field temperature and strengthen heat dissipation by optimizing the structure of distributed high power LED components. The origin of the heat dissipation problem of LED is analyzed by mathematical description. The concept of thermal coupling in distributed high power LED is put forward in order to carry out the research with clear research purpose, and then the thermal analysis is carried out in detail on the chip. A complete thermal model is established, and theoretical analysis and comparison are carried out. Secondly, the component temperature is collected by using the method of thermocouple measurement, and the single heat dissipation performance is analyzed and studied by using orthogonal analysis to each factor that mainly affects the radiator of distributed high-power LED lamps and lanterns. A series of factors, such as heat sink size, rib thickness, rib height, rib spacing, and so on, were used to draw the curves of the LED chip junction temperature, which clearly reflected the influence of each factor on the LED chip junction temperature. Finally, by using finite element thermal simulation to simulate the optimization results, the optimization direction proposed in this paper is more clear to weaken the thermal coupling of the thermal field and enhance the heat dissipation.
【学位授予单位】：哈尔滨理工大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN312.8

【共引文献】