印制线路板上硫氰酸亚金钾体系化学镀金
发布时间：2019-03-19 11:38
【摘要】：以硫氰酸亚金钾[KAu(SCN)_2]为金源对镀镍印制线路板进行化学镀金。采用单因素试验研究了镀液中Au~+含量、硫氰酸铵含量、pH和温度对沉金速率、金层外观和结合力的影响,得到最优配方和工艺参数为:Au~+2.0 g/L,硫氰酸铵15 g/L,添加剂Cy-808 150 mL/L,pH 3.0,温度50℃。在此条件下沉金速率约为6 nm/min,结晶均匀细致,呈光亮的金黄色。
[Abstract]:Electroless gold plating on nickel-plated printed circuit board was carried out with potassium thiocyanate [KAu (SCN) _ 2] as gold source. The effects of Au~ content, ammonium thiocyanate content, pH and temperature on gold deposition rate, appearance and binding force of gold layer were studied by single factor test. The optimum formula and technological parameters were obtained as follows: Au~ 2.0g / L, ammonium thiocyanate 15g / L, Additive Cy-808 150 mL/L,pH 3.0, temperature 50 鈩，
本文编号：2443486
[Abstract]:Electroless gold plating on nickel-plated printed circuit board was carried out with potassium thiocyanate [KAu (SCN) _ 2] as gold source. The effects of Au~ content, ammonium thiocyanate content, pH and temperature on gold deposition rate, appearance and binding force of gold layer were studied by single factor test. The optimum formula and technological parameters were obtained as follows: Au~ 2.0g / L, ammonium thiocyanate 15g / L, Additive Cy-808 150 mL/L,pH 3.0, temperature 50 鈩，
本文编号：2443486
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