光模块中刚柔线路板电连接宽带阻抗匹配研究

发布时间：2019-04-03 20:00

【摘要】：文章分别对光收发组件中50Ω柔性线路板和50Ω刚性线路板,以及25Ω柔性线路板和50Ω刚性线路板间的电互连阻抗匹配进行了设计、仿真与实验验证。对于50Ω_50Ω刚柔板的高频连接,通过对其返回路径的通孔位置优化设计,使反射损耗S11在高频段降低约11%,插入损耗S21减小19%;对于25Ω_50Ω刚柔板的高频连接,提出新的优化方式:在硬板信号线的金手指上做通孔设计,并提取该结构的寄生参数,构建电路模型。该结构大幅提高了连接处容性阻抗,降低了阻抗失配,使得S11在高频段降低约38.2%,S21减小约34%。提出的柔性线路板与刚性线路板的电互连方式,能实现传输线间的阻抗匹配,减小信号反射和插入损耗,提高光模块传输质量,对于光器件的接入具有较大应用价值。
[Abstract]:In this paper, the impedance matching between 50 惟 flexible circuit board and 50 惟 rigid circuit board, 25 惟 flexible circuit board and 50 惟 rigid circuit board is designed, simulated and verified by experiment. For the high frequency connection of 50 惟 _ 50 惟 rigid and flexible plate, the reflection loss S _ 11 and insertion loss S _ 21 are reduced by about 11% and 19%, respectively, by optimizing the through-hole position of the return path of 50 惟 _ 50 惟 rigid and flexible plate. For the high-frequency connection of 25 惟 _ 50 惟 rigid and flexible plate, a new optimization method is proposed: the through-hole design is made on the golden finger of the signal line of the rigid plate, and the parasitic parameters of the structure are extracted, and the circuit model is constructed. The structure greatly increases the capacitive impedance at the junction and reduces the impedance mismatch, which reduces S11 by 38.2% and S21 by about 34% in the high frequency region. The proposed electrical interconnection mode between flexible circuit board and rigid circuit board can realize impedance matching between transmission lines, reduce signal reflection and insertion loss, and improve transmission quality of optical modules. It is of great application value for optical device access.
【作者单位】：中国科学院微电子研究所;中国科学院大学;华进半导体封装先导技术研发中心有限公司;西安微电子技术研究所;
【基金】：国家“863”计划项目(2015AA016904)
【分类号】：TN41

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