晶圆键合技术在LED应用中的研究进展
发布时间：2019-04-10 13:20
【摘要】：简要介绍了晶圆键合技术在发光二极管(LED)应用中的研究背景,分别论述了常用的黏合剂键合技术、金属键合技术和直接键合技术在高亮度垂直LED制备中的研究现状,包括它们的材料组成和作用、工艺步骤和参数以及优缺点。其中,黏合剂键合是一种低温键合技术,且易于应用、成本低、引入应力小,但可靠性较差;金属键合技术能提供高热导、高电导的稳定键合界面,与后续工艺兼容性好,但键合温度高,引入应力大,易造成晶圆损伤;表面活化直接键合技术能实现室温键合,降低由于不同材料间热失配带来的负面影响,但键合良率有待提高。
[Abstract]:This paper briefly introduces the research background of wafer bonding technology in the application of light emitting diode (LED), and discusses the research status of common adhesive bonding technology, metal bonding technology and direct bonding technology in the preparation of high brightness vertical LED, respectively. Including their material composition and function, process steps and parameters, as well as advantages and disadvantages. Among them, adhesive bonding is a low temperature bonding technology, and easy to use, low cost, low introduction stress, but poor reliability; Metal bonding technology can provide a stable bonding interface with high thermal conductivity and high conductivity, and has good compatibility with the subsequent process, but the bonding temperature is high, the introduction stress is large, and the wafer damage is easy to be caused. Surface activated direct bonding technology can achieve room temperature bonding and reduce the negative effects caused by thermal mismatch between different materials, but the bonding yield needs to be improved.
【作者单位】： 河北工业大学电子信息工程学院;天津市电子材料与器件重点实验室;中国电子科技集团公司第十八研究所;
【基金】：河北省高层次人才资助项目百人计划项目(W2013100006) 河北省科技计划资助项目(15211017D)
【分类号】：TN312.8
[Abstract]:This paper briefly introduces the research background of wafer bonding technology in the application of light emitting diode (LED), and discusses the research status of common adhesive bonding technology, metal bonding technology and direct bonding technology in the preparation of high brightness vertical LED, respectively. Including their material composition and function, process steps and parameters, as well as advantages and disadvantages. Among them, adhesive bonding is a low temperature bonding technology, and easy to use, low cost, low introduction stress, but poor reliability; Metal bonding technology can provide a stable bonding interface with high thermal conductivity and high conductivity, and has good compatibility with the subsequent process, but the bonding temperature is high, the introduction stress is large, and the wafer damage is easy to be caused. Surface activated direct bonding technology can achieve room temperature bonding and reduce the negative effects caused by thermal mismatch between different materials, but the bonding yield needs to be improved.
【作者单位】： 河北工业大学电子信息工程学院;天津市电子材料与器件重点实验室;中国电子科技集团公司第十八研究所;
【基金】：河北省高层次人才资助项目百人计划项目(W2013100006) 河北省科技计划资助项目(15211017D)
【分类号】：TN312.8
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