石墨表面熔融硅的润湿行为研究
发布时间：2019-05-18 12:55
【摘要】：熔融硅在石墨表面的润湿规律对于超薄硅片的横向拉模制造尤为重要.本文利用COMSOL软件模拟了理想条件下熔融硅在光滑石墨表面的润湿过程,并借助高温高真空接触角测量仪对高温条件下石墨表面熔融硅的润湿性能开展了实验研究.考察了石墨表面粗糙度(R_a=0.721μm与R_a=0.134μm)、环境温度(1737—1744 K)、恒温持续时间(10—30 s)等因素对润湿角的影响.结合固-液、气-液界面的压力、速度分布图,分析了恒定温度、毛细效应下表面张力变化对润湿过程的影响机制.研究结果表明,相同温度下,石墨表面硅液滴的润湿角随石墨表面粗糙度增大而减小.对同一粗糙度表面,润湿角在相同温度下随保温时间的增加略微减小,且变化的幅度随温度升高而减小.当液滴半径远小于5 mm时,表面张力在润湿过程中起主导作用;当液滴半径大于5 mm时,液滴自身重力的影响不可忽略.
[Abstract]:The wetting law of molten silicon on graphite surface is particularly important for the transverse die drawing of ultra-thin silicon wafer. In this paper, the wetting process of molten silicon on smooth graphite surface under ideal conditions was simulated by COMSOL software, and the wetting properties of molten silicon on graphite surface at high temperature and high vacuum were studied by means of high temperature and high vacuum contact angle measuring instrument. The effects of graphite surface roughness (R 鈮，
本文编号：2480024
[Abstract]:The wetting law of molten silicon on graphite surface is particularly important for the transverse die drawing of ultra-thin silicon wafer. In this paper, the wetting process of molten silicon on smooth graphite surface under ideal conditions was simulated by COMSOL software, and the wetting properties of molten silicon on graphite surface at high temperature and high vacuum were studied by means of high temperature and high vacuum contact angle measuring instrument. The effects of graphite surface roughness (R 鈮，
本文编号：2480024
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