可溶性聚酰亚胺用于无胶双面挠性覆铜板的研究
发布时间：2019-06-12 18:18
【摘要】：使用化学亚胺化法合成可溶性聚酰亚胺,在铜箔上涂布可溶性聚酰亚胺和热塑性聚酰亚胺前驱体混合液,经过高温亚胺化得到无胶单面覆铜板,再与铜箔进行高温压合最终制得无胶双面覆铜板。通过测试双面覆铜板的剥离强度和PI复合膜的玻璃化转变温度、热分解温度、热膨胀系数和介电性能,评价其应用于无胶双面覆铜板的可行性。结果表明:基材的介电常数为2.5~2.7,介质损耗因数为0.004~0.006,剥离强度大于1.0 N/mm,同时热膨胀系数较低。该结构无胶双面覆铜板具有较好的综合性能,可应用于高频高速挠性覆铜板领域。
[Abstract]:Soluble polyimide was synthesized by chemical imidization, and the mixture of soluble polyimide and thermoplastic polyimide precursor was coated on copper foil. The non-adhesive single-sided copper laminate was obtained by high temperature imidization, and then the adhesive-free double-sided copper laminate was prepared by high temperature pressing with copper foil. By measuring the peeling strength of double-sided copper laminate and the glass transition temperature, thermal decomposition temperature, thermal expansion coefficient and dielectric properties of PI composite film, the feasibility of its application to non-adhesive double-sided copper laminate was evaluated. The results show that the dielectric constant of the substrate is 2.5 鈮，
本文编号：2498209
[Abstract]:Soluble polyimide was synthesized by chemical imidization, and the mixture of soluble polyimide and thermoplastic polyimide precursor was coated on copper foil. The non-adhesive single-sided copper laminate was obtained by high temperature imidization, and then the adhesive-free double-sided copper laminate was prepared by high temperature pressing with copper foil. By measuring the peeling strength of double-sided copper laminate and the glass transition temperature, thermal decomposition temperature, thermal expansion coefficient and dielectric properties of PI composite film, the feasibility of its application to non-adhesive double-sided copper laminate was evaluated. The results show that the dielectric constant of the substrate is 2.5 鈮，
本文编号：2498209
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