SMD真空拾取头设计与优化
发布时间：2019-06-28 10:28
【摘要】：进入21世纪以来,中国已成为全球最大、最重要的SMT(Surface Mount Technology,表面贴装技术)市场。SMT产品与装备是半导体封装产业的关键环节,对应要求SMD(Surface Mounted Devices,表面安装器件)元件高效、稳定、准确的拾取、转移和放置。拾取头的作用便是拾取和放置SMD元器件。由于SMD元件种类繁多、尺寸多样,工艺中迫切需要具有良好适应性的拾取头。本文主要对SMD拾取头进行设计与优化,开发出了适用于SMD检测、转移系统的多适应性拾取头。通过结构设计、数值仿真计算和实验测试等研究,取得了以下成果:1)设计了创新的吸嘴组件,更大范围地适应多种尺寸的SMD元器件,避免了因SMD类型变化导致的频繁更换吸嘴的工作,提高了生产效率。2)仿真分析了吸嘴特征参数对拾取流场的影响,基于Fluent软件的仿真结果表明:在直径突变的地方添加倒角并不能对吸嘴外流场产生明显的影响;接通的通气孔数越多,压力分布越均匀,真空度越高,越有利于拾取SMD元器件;吸嘴通气孔的直径越大,吸嘴口部的压力分布越不均匀,但是吸嘴口部的真空度越高;吸嘴口部的凹槽越深,它的压力分布越均匀。3)实测验证了所设计方案和仿真结论,通过在安装新拾取头的SMD检测设备上进行实验,获得如下结论:拾取头的多适应性实验验证了拾取头设计的合理性;获得了进气压力和真空度的关系对应表,为以后检测设备是否漏气提供了数据支持;分析了拾取头拾取芯片的不同错误产生的原因,为以后设备故障的分析提供了相应地参数依据和技术支持。总之,本课题所设计适应性拾取头结构和分析结论能够满足SMD转移工艺的广泛需求,并已在实际检测设备上得到验证。
[Abstract]:Since the beginning of the 21st century, China has become the largest and most important SMT (Surface Mount Technology, surface mount technology in the world. SMT products and equipment are the key links in the semiconductor packaging industry, corresponding to the requirements of SMD (Surface Mounted Devices, surface installation devices) components are picked up, transferred and placed efficiently, stably and accurately. The function of pickup head is to pick up and place SMD components. Because of the variety and size of SMD components, it is urgent to have a good adaptability pick-up head in the process. In this paper, the SMD pickup head is designed and optimized, and a multi-adaptive pickup head suitable for SMS detection and transfer system is developed. Through the research of structure design, numerical simulation calculation and experimental test, the following results have been obtained: 1) the innovative suction nozzle assembly is designed to adapt to SMD components of various sizes, which avoids the frequent replacement of suction nozzle caused by the change of SMD type, and improves the production efficiency. 2) the influence of characteristic parameters of suction nozzle on picking up flow field is simulated and analyzed. The simulation results based on Fluent software show that the addition of chamfer in the place of sudden change of diameter can not have an obvious effect on the outflow field of suction nozzle. The more the number of ventilation holes connected, the more uniform the pressure distribution and the higher the vacuum degree, the more favorable it is to pick up SMD components. The larger the diameter of the suction hole is, the more uneven the pressure distribution is, but the higher the vacuum degree of the suction mouth is, the more uniform the pressure distribution is, the higher the vacuum degree of the suction mouth is. The deeper the groove at the suction port is, the more uniform the pressure distribution is. 3) the designed scheme and simulation results are verified by the actual measurement and verification. Through the experiment on the SMD detection equipment with the new pickup head, the following conclusions are obtained: the multi-adaptability experiment of the pickup head verifies the rationality of the pickup head design, and obtains the corresponding table of the relationship between intake pressure and vacuum degree, which provides data support for the future detection of whether the equipment is leaking or not. The causes of different errors in picking up chips by pickup head are analyzed, which provides the corresponding parameter basis and technical support for the analysis of equipment faults in the future. In a word, the adaptive pickup head structure and analysis conclusion designed in this paper can meet the extensive needs of SMD transfer process, and have been verified on the actual testing equipment.
【学位授予单位】：华中科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN305
本文编号：2507226
[Abstract]:Since the beginning of the 21st century, China has become the largest and most important SMT (Surface Mount Technology, surface mount technology in the world. SMT products and equipment are the key links in the semiconductor packaging industry, corresponding to the requirements of SMD (Surface Mounted Devices, surface installation devices) components are picked up, transferred and placed efficiently, stably and accurately. The function of pickup head is to pick up and place SMD components. Because of the variety and size of SMD components, it is urgent to have a good adaptability pick-up head in the process. In this paper, the SMD pickup head is designed and optimized, and a multi-adaptive pickup head suitable for SMS detection and transfer system is developed. Through the research of structure design, numerical simulation calculation and experimental test, the following results have been obtained: 1) the innovative suction nozzle assembly is designed to adapt to SMD components of various sizes, which avoids the frequent replacement of suction nozzle caused by the change of SMD type, and improves the production efficiency. 2) the influence of characteristic parameters of suction nozzle on picking up flow field is simulated and analyzed. The simulation results based on Fluent software show that the addition of chamfer in the place of sudden change of diameter can not have an obvious effect on the outflow field of suction nozzle. The more the number of ventilation holes connected, the more uniform the pressure distribution and the higher the vacuum degree, the more favorable it is to pick up SMD components. The larger the diameter of the suction hole is, the more uneven the pressure distribution is, but the higher the vacuum degree of the suction mouth is, the more uniform the pressure distribution is, the higher the vacuum degree of the suction mouth is. The deeper the groove at the suction port is, the more uniform the pressure distribution is. 3) the designed scheme and simulation results are verified by the actual measurement and verification. Through the experiment on the SMD detection equipment with the new pickup head, the following conclusions are obtained: the multi-adaptability experiment of the pickup head verifies the rationality of the pickup head design, and obtains the corresponding table of the relationship between intake pressure and vacuum degree, which provides data support for the future detection of whether the equipment is leaking or not. The causes of different errors in picking up chips by pickup head are analyzed, which provides the corresponding parameter basis and technical support for the analysis of equipment faults in the future. In a word, the adaptive pickup head structure and analysis conclusion designed in this paper can meet the extensive needs of SMD transfer process, and have been verified on the actual testing equipment.
【学位授予单位】：华中科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN305
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