直流电沉积法制备纳米晶体镍镀层及其热稳定性研究（英文）

发布时间：2018-01-07 13:15

  本文关键词：直流电沉积法制备纳米晶体镍镀层及其热稳定性研究（英文）　出处：《稀有金属材料与工程》2016年04期 　论文类型：期刊论文

  更多相关文章： 纳米晶体镍 电沉积 显微硬度 热稳定性

【摘要】：利用直流电沉积技术系统分析电流密度和镀液糖精浓度对纳米晶体镍性能的影响。结果表明,电流密度在0.5~1.5 A/dm~2时,可调节糖精浓度制备出显微硬度HV分布为415~603 MPa的纳米晶镀层。小电流密度0.5 A/dm~2时,随糖精浓度增大,镀层(200)面衍射强度增强,结构由(111),(200)双织构向(200)面转变,且镀层内应力降低,糖精浓度增大到1.2 g/L时,内应力降为0。镀层晶粒尺寸为28~98 nm时,直到600℃晶粒才开始长大,结构稳定性较好;晶粒尺寸为10 nm时,晶粒在317℃异常长大,其结构稳定性显著下降。
[Abstract]:The effects of current density and concentration of saccharin on the properties of nanocrystalline nickel were systematically analyzed by direct current electrodeposition technique. The results showed that the current density was between 0.5 and 1.5 A / dm ~ 2:00. The nanocrystalline coating with microhardness HV distribution of 415 ~ 603 MPa was prepared by adjusting saccharin concentration, and the low current density was 0.5A / dm ~ 2:00 with increasing saccharin concentration. The diffraction intensity of the coating surface is enhanced, the structure changes from the double texture to the surface of the coating, and the internal stress of the coating decreases and the saccharin concentration increases to 1.2 g 路L ~ (-1) 路L ~ (-1) 路L ~ (-1) 路L ~ (-1) 路L ~ (-1). When the grain size of the coating is 2898 nm, the grain size will not grow until 600 鈩，

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