蓝宝石不同晶面磨削特性比较

发布时间：2018-02-26 19:44

  本文关键词： 蓝宝石 晶面 磨削力 磨削特性 表面形貌　出处：《光学精密工程》2017年05期 　论文类型：期刊论文

【摘要】：比较了蓝宝石不同晶面磨削特性的差异。对蓝宝石晶体的A面、C面、M面及R面开展精密磨削试验,并从磨削力、磨削力比、比磨削能及表面形貌等角度比较了蓝宝石4个晶面磨削特性的差异。采用金刚石砂轮在精密平面磨床上对蓝宝石4个晶面进行磨削,采用测力仪测量磨削过程中的磨削力,并根据所测得的磨削力计算磨削力比和比磨削能。最后,采用扫描电子显微镜观测工件磨削表面形貌。试验结果显示:蓝宝石的4个晶面中C面的磨削力最大,其次是M面和A面,R面的磨削力最小;比磨削能亦为C面最大,其次是M面和A面,R面的比磨削能最小;磨削力比则是M面最大,其次是A面和C面,R面的磨削力比最小。在相同磨削条件下,蓝宝石不同晶面磨削材料的去除方式有所不同,A面、M面和R面主要以脆性断裂、破碎和解离方式去除为主,且破碎坑较大,表面相对较为粗糙;而C面则存在部分脆性断裂和部分粉末化去除,破碎坑较小,表面相对平整。因此,蓝宝石不同晶面的磨削特性差异明显,其磨削力、磨削力比、比磨削能及材料去除方式均存在明显的不同。
[Abstract]:The grinding characteristics of different crystal surfaces of sapphire are compared. The precision grinding tests are carried out on the C / M and R surfaces of sapphire crystals, and the grinding force ratio, grinding force ratio, grinding force ratio, grinding force ratio, grinding force ratio, grinding force ratio, grinding force ratio, grinding force ratio, The grinding characteristics of four crystal surfaces of sapphire are compared in terms of specific grinding energy and surface morphology. Four crystal surfaces of sapphire are ground by diamond wheel on precision plane grinding machine, and grinding force is measured by dynamometer. The grinding force ratio and specific grinding energy are calculated according to the measured grinding force. Finally, the grinding surface morphology of the workpiece is observed by scanning electron microscope. The experimental results show that the grinding force of C plane is the largest in the four crystal planes of sapphire. Secondly, the grinding force of M plane and A plane R plane is the smallest, the specific grinding energy is also the largest in C plane, the second is the specific grinding energy of M plane and A plane R plane, and the grinding force ratio is M plane. Secondly, the grinding force ratio of A plane and C plane / R plane is the smallest. Under the same grinding conditions, the removal methods of different crystal surfaces of sapphire grinding materials are different, such as brittle fracture, breakage and dissociation. The crashing pit is larger and the surface is relatively rough, while the C plane has partial brittle fracture and partial powder removal, the crater is small and the surface is relatively flat. Therefore, the grinding characteristics of different crystal planes of sapphire are different, and the grinding force is obvious. There are obvious differences in grinding force ratio, specific grinding energy and material removal methods.
【作者单位】： 华侨大学制造工程研究院;
【基金】：国家自然科学基金-海峡联合基金重点项目(No.U1305241);国家自然科学基金-面上项目(No.51675192,No.51575197)
【分类号】：O786
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本文编号：1539443