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基于铜离子与DNA相互作用的铜离子检测

发布时间:2018-03-28 03:12

  本文选题:DNA修饰电极 切入点:电化学传感器 出处:《高等学校化学学报》2016年07期


【摘要】:利用铜离子(Cu~(2+))可与DNA分子中的碱基相互作用形成络合物的性质,将Cu~(2+)富集在DNA修饰电极表面,进而采用微分脉冲伏安法(DPV)实现了铜离子的检测.此外,由于乙二胺四乙酸(EDTA)对Cu~(2+)具有更强的络合能力,富集于DNA修饰电极表面的Cu~(2+)很容易被洗脱液中的EDTA络合,从而实现修饰电极的再生和重复利用.实验结果表明,在最佳实验条件下,Cu~(2+)浓度在2.0×10-6~1.0×10-5mol/L和2.0×10-5~1.0×10-4mol/L范围内与其相对还原峰电流强度(I-I0)呈良好的线性关系,且该传感器简单、稳定,可循环使用.
[Abstract]:The copper ion was determined by differential pulse voltammetry (DPV). The copper ion can interact with the base group in the DNA molecule to form a complex. The Cu~(2) is enriched on the surface of the DNA modified electrode, and then the copper ion is detected by differential pulse voltammetry. Because ethylenediamine tetraacetic acid (EDTA) has stronger complexing ability to Cu~(2, Cu~(2 enriched on the surface of DNA modified electrode is easy to be complexed with EDTA in eluent, thus the modified electrode can be regenerated and reused. Under the optimum experimental conditions, the relative reduction peak current intensity (I-I0) of the sensor is linear in the range of 2.0 脳 10 ~ (-6) 10-5mol/L and 2.0 脳 10 ~ (-5) 10-4mol/L, and the sensor is simple, stable and recyclable.
【作者单位】: 陕西师范大学化学化工学院陕西省生命分析化学重点实验室;
【基金】:国家自然科学基金(批准号:21575085)资助~~
【分类号】:O657.1

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