陶瓷元件免烧型贱金属电极制备技术研究

发布时间：2018-10-18 21:00

【摘要】：近年来,随着各种电子产品的普及以及更新换代的速度加快,具有体积小、容量大、耐腐蚀、耐高温等优点的陶瓷电容器的市场需求量与日俱增。陶瓷电容器的电极材料一般采用贵金属银,其高昂的价格使得陶瓷电容器成本偏高,采用贱金属电极代替贵金属电极已成为陶瓷电容器行业发展的必然趋势。本论文围绕陶瓷电容器电极贱金属化展开研究。本论文选取贱金属铜为电极材料,采用化学镀法来实现陶瓷电极贱金属化。利用喷墨打印技术在陶瓷基材上形成图形化的活化层,以此作为后续化学沉铜的催化种子层。以金属铜层的外观色泽、微观形貌、方阻以及附着力为考察指标,优化化学沉铜的温度以及沉积时间。结果表明,在沉积温度为45~50℃,沉积时间约为20 min条件下,所得到的铜层外观色泽光亮,铜颗粒大小较均匀,方阻以及附着力最佳。论文在优化施镀工艺条件基础上,以传统化学镀铜效果为参照,探讨了超声辅助化学镀的超声参数对镀层质量的影响。结果表明,在化学沉铜过程中引入超声辅助沉积可有效提高电极质量,这是因为超声波在化学沉积中能促进氢气的排出,加快沉积速度,提升镀层的结合力。在喷墨印制化学沉铜催化种子层前对陶瓷基材进行粗化预处理,探讨了粗化时间对铜层附着力的影响。在优化制备条件下所得到的铜电极色泽光亮、铜颗粒致密均匀、铜层抗熔蚀性强、可焊性优良,铜层在陶瓷基材上的附着力可达到2.6kg/cm2,电阻率低至3.6μ?·cm。铜电极陶瓷电容器的电容量和损耗均达到了工业应用要求。本论文所开发的陶瓷电容器贱金属电极制备技术具有工艺简单、成本低、可批量化制备的优点,且整个制备过程无需高温烧结,即可获得性能优良的贱金属电极。这可为陶瓷电容器电极的贱金属化提供实用的技术参考。
[Abstract]:In recent years, with the popularity of various electronic products and the speed of upgrading, the market demand of ceramic capacitors with the advantages of small volume, large capacity, corrosion resistance and high temperature resistance is increasing day by day. The electrode material of ceramic capacitor is usually made of precious metal silver, and its high price makes the cost of ceramic capacitor on the high side. It has become an inevitable trend of ceramic capacitor industry to replace precious metal electrode with base metal electrode. In this paper, the base metal of ceramic capacitor electrode is studied. In this paper, base metal copper is chosen as electrode material and electroless plating method is used to realize base metal of ceramic electrode. The ink-jet printing technique was used to form a graphical activation layer on the ceramic substrate, which was used as the catalytic seed layer for the subsequent chemical deposition of copper. The temperature and deposition time of copper deposition were optimized by using the appearance, color, micromorphology, square resistance and adhesion of metal copper layer as the index of investigation. The results show that when the deposition temperature is 45 ~ 50 鈩，

本文编号：2280352