低压键合技术及其机理研究

发布时间：2017-12-31 14:17

本文关键词：低压键合技术及其机理研究　出处：《合肥工业大学》2012年硕士论文　论文类型：学位论文

【摘要】：在微纳流控通道中流体和分子传输具有特异性质，相关研究突破了传统理论的一些重要概念，并在生化等方面有重大应用。聚合物微纳流控通道的可控加工是该领域的研究热点。热键合是聚合物微纳通道密封的关键技术，传统热键合过程由于需要高温高压，很容易造成通道变形和堵塞，这是制约器件化的关键问题。本文提出一种在低压下完成微纳流控系统制造的方法,避免了传统加工方法中的一些缺点。论文中给出了整个加工流程以及关键步骤，并进行了流体测试。通过实验结果可以看出，该方法能制作出大面积均匀的纳米通道。本文根据伯肃叶公式理论，，构建微尺度下聚合物的粘度和壁面滑移模型，研究了聚合物在毛细力和键合压力共同作用下顶部填充的机理，阐明了微尺度效应和压力、温度、胶层厚度等工艺因素对顶部填充的影响机制；通过有限元方法，利用VOF模型，模拟了低压键合过程中毛细填充过程，模拟结果和实验结果保持一致,同时分析了形成不同形状通道的理论条件。这些结果能有助于理解顶部填充过程，对优化工艺参数起到很大的理论指导作用。本文通过膨胀中心线的假设，设计出“填充阻隔器”结构以降低键合压力在挤压流动过程产生的位移，分流填充量，从而抑制顶部填充。本文提出的低压键合技术,对进一步探索聚合物微纳流体系统加工中相关科学问题及在各领域的应用都具有重要的理论意义和实用价值。
[Abstract]:In the micro-nanofluidic channel, fluid and molecular transport have special properties, and some important concepts of traditional theory have been broken through in related research. And it has great application in biochemistry and so on. The controllable processing of polymer micro-nano channel is the research hotspot in this field. Thermal bonding is the key technology of polymer micro-nano channel sealing. Due to the need of high temperature and high pressure, the traditional hot bonding process can easily lead to channel deformation and blockage, which is the key problem restricting the device. In this paper, a method of fabricating micro / nano flow control system at low voltage is proposed, which avoids some disadvantages of traditional machining methods. The whole process and key steps are given in this paper. The experimental results show that the method can produce a large area of uniform nanochannels. In this paper, the viscosity and wall slip models of polymer on microscale are constructed according to the theory of Bosule formula, and the mechanism of top filling of polymer under the action of capillary force and bonding pressure is studied. The influence mechanism of microscale effect, pressure, temperature, thickness of rubber layer on top filling is explained. Through finite element method and VOF model, the capillary filling process in low pressure bonding process is simulated, and the simulation results are consistent with the experimental results. At the same time, the theoretical conditions for the formation of different shape channels are analyzed. These results can help to understand the top filling process and play a great role in guiding the optimization of process parameters. Based on the assumption of the expansion center line, a "fill barrier" structure is designed to reduce the displacement caused by bonding pressure in the extrusion flow process and to separate the filling amount. The low pressure bonding technique proposed in this paper is of great theoretical significance and practical value for the further exploration of the related scientific problems in polymer micro-nano fluid system processing and its application in various fields.
【学位授予单位】：合肥工业大学
【学位级别】：硕士
【学位授予年份】：2012
【分类号】：TH16

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