微结构片外弯曲测试装置及试样设计

发布时间：2018-10-26 12:03

【摘要】：硅是微电子机械系统(简称微机电系统)中最常见的功能结构材料,可靠性是制约硅微构件小尺度加工和大规模制造的瓶颈问题.为研究硅微构件的力学特性,本文开发了一套以压电驱动、微力测量、位移检测为核心组件的片外测试系统.设计了一种将四个弯曲测试梁集于一体的微结构,借助有限元方法确定其尺寸,并用理论方法验证有限元分析的合理性.本文着重确保了四个关键设计目标:一、每根测试梁最大应力应位于其与外框架结合处;二、未断裂测试梁的最大应力受其他梁的断裂的影响应足够小;三、各个测试梁的最大应力的差别应足够小;四、支撑梁的最大应力应明显小于测试梁.最后测试了试样的弯曲强度,实验加载曲线和有限元分析基本吻合,表明测试装置和试样设计是合理的,为后续的硅微构件可靠性测试奠定了基础.
[Abstract]:Silicon is the most common functional structural material in microelectromechanical systems (MEMS). Reliability is the bottleneck of small-scale machining and large-scale manufacturing of silicon micro-components. In order to study the mechanical properties of silicon microstructures, an off-chip testing system with piezoelectric actuation, micro-force measurement and displacement detection is developed. In this paper, a kind of micro-structure which integrates four bending test beams is designed, and its size is determined by means of finite element method, and the rationality of finite element analysis is verified by theoretical method. In this paper, four key design objectives are emphasized: first, the maximum stress of each test beam should be located at its joint with the outer frame; second, the maximum stress of the non-fracture test beam should be sufficiently small to be affected by the fracture of other beams. Third, the difference of the maximum stress of each test beam should be small enough, and fourth, the maximum stress of the braced beam should be obviously smaller than that of the test beam. Finally, the bending strength of the specimen is tested, and the experimental loading curve is in good agreement with the finite element analysis, which shows that the testing device and the sample design are reasonable, which lays a foundation for the reliability test of the silicon microstructures.
【作者单位】：南昌大学科学技术学院;
【基金】：江西省高等学校教学改革研究省级课题(JXJG-14-28-10,JXJG-15-30-3)
【分类号】：TH-39

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