当前位置:主页 > 科技论文 > 机械论文 >

引线键合自动送线系统关键技术研究

发布时间:2019-06-11 21:34
【摘要】:自动送线系统是全自动引线键合机的关键组成部分,其性能直接影响引线键合的质量和效率。本文旨在提高自动送线系统金线传输的稳定性,降低金线在传输过程中的摩擦力以及振动,针对送线系统及其金线的动力学特性进行仿真分析,并通过实验获得金线张紧力与气压的关系。最终搭建了自动送线系统,基于LabVIEW平台对送线系统进行了控制和实验调试。全文工作和取得的成果如下: 介绍了引线键合的工艺过程,分析了引线线夹的开合动作与键合头空间运动的时序关系,探讨了键合过程中可能存在的问题。基于此,初步确定了送线系统的整体结构,并分析其关键部件的结构和性能。 分析了线夹打开状态下金线的张力大小和振动情况对线键合质量的影响,探讨了引线键合过程中线夹开合的时序问题。基于气体射流及圆柱绕流理论,推导金线所受的总阻力与气体来流速度及气压的关系式。利用牛顿内摩擦定律,推导金线的真空张紧力与气体流速及气压的关系式。 基于有限元分析方法,借助ANSYS软件的流固耦合模块对金线的气轨张紧力情况进行仿真分析。对金线进行动力学分析,探索气压的合理范围,进而有效保证金线在高速运动情况下振动较小,从而有利于金线的稳定传输。与解析分析结果相比较,初步验证了金线张紧力仿真分析的正确性。 搭建了引线键合自动送线软硬件平台,实现了金线的平稳快速传输。通过实验研究了金线在气体导轨和真空张紧装置内的受力情况,确定了金线稳定传输所需要的气压值范围。 上述研究对提高自动送线系统的性能具有重要意义,研究结果为引线键合及其相关领域的应用提供了重要的理论和实践指导。
[Abstract]:Automatic wire feeding system is the key part of automatic wire bonding machine, and its performance directly affects the quality and efficiency of wire bonding. The purpose of this paper is to improve the stability of gold wire transmission in automatic wire transmission system, to reduce the friction and vibration of gold wire in the process of transmission, to simulate and analyze the dynamic characteristics of wire feeding system and its gold wire, and to obtain the relationship between tension force and air pressure of gold wire through experiments. Finally, the automatic wire transmission system is built, and the wire transmission system is controlled and debugged based on LabVIEW platform. The work and achievements of this paper are as follows: the process of wire bonding is introduced, the timing relationship between the opening and closing action of the wire clip and the spatial motion of the bonding head is analyzed, and the possible problems in the bonding process are discussed. Based on this, the overall structure of the wire transmission system is preliminarily determined, and the structure and performance of its key components are analyzed. The influence of the tension and vibration of gold wire on the quality of wire bonding is analyzed, and the timing problem of wire clamp opening and closing in the process of wire bonding is discussed. Based on the theory of gas jet and cylinder flow around, the relationship between the total resistance of gold wire and the velocity and pressure of gas flow is derived. Based on Newton's law of internal friction, the relationship between vacuum tension force of gold line and gas velocity and air pressure is derived. Based on the finite element analysis method, the tension of the gas rail of the gold wire is simulated and analyzed with the help of the fluid-solid coupling module of ANSYS software. The dynamic analysis of the gold line is carried out to explore the reasonable range of air pressure, and then the vibration of the effective margin line is small under the condition of high speed motion, which is beneficial to the stable transmission of the gold line. Compared with the analytical results, the correctness of the simulation analysis of the tension force of the gold wire is preliminarily verified. The hardware and software platform of wire bonding automatic wire transmission is built, and the smooth and fast transmission of gold wire is realized. The stress of gold wire in gas guideway and vacuum tensioner is studied by experiment, and the range of gas pressure needed for stable transmission of gold wire is determined. The above research is of great significance to improve the performance of automatic wire feeding system. The research results provide important theoretical and practical guidance for the application of wire bonding and its related fields.
【学位授予单位】:天津大学
【学位级别】:硕士
【学位授予年份】:2012
【分类号】:TH165.1

【参考文献】

相关期刊论文 前6条

1 童朝南,纪智,彭开香,董洁;卷取张力控制新方法[J];北京科技大学学报;2002年04期

2 李元升;引线键合机工艺技术分析[J];电子工业专用设备;2004年03期

3 朱正宇;胡巧声;;半导体封装超声波压焊的工艺参数优化[J];电子工业专用设备;2006年03期

4 潘峰;颜向乙;郑轩;广明安;王丰;;全自动键合机工艺调试方法[J];电子工业专用设备;2009年05期

5 张世恩,童志义;我国半导体设备现状及发展建议[J];电子工业专用设备;1998年01期

6 董永谦;热声焊机的研制及工艺研究[J];电子工艺技术;2004年02期

相关博士学位论文 前1条

1 武一民;引线键合系统设计理论与关键技术[D];天津大学;2008年

相关硕士学位论文 前10条

1 周灵聪;轨道集装箱龙门起重机结构系统的运动数值仿真及动力学分析[D];兰州理工大学;2011年

2 邱睿;超细间距引线键合第一键合点影响因素研究[D];华中科技大学;2004年

3 杨志高;智能IC引线键合机图像识别系统的研究[D];广东工业大学;2005年

4 范柱子;IC引线键合头运动轨迹规划[D];华中科技大学;2005年

5 杨文建;超细间距引线键合工艺的试验研究[D];华中科技大学;2005年

6 刘长宏;面向引线键合工艺的质量影响因素与规律的分析[D];广东工业大学;2008年

7 李吉;全自动金丝球焊机快速送丝系统关键技术研究[D];哈尔滨工业大学;2007年

8 莫卓亚;超微间距全自动金线焊接机的工艺优化技术[D];哈尔滨工业大学;2008年

9 陆麟;金线键合中“塌线”问题的研究[D];苏州大学;2009年

10 王福军;引线键合高频超声换能器的设计和键合头运动控制研究[D];天津大学;2009年



本文编号:2497468

资料下载
论文发表

本文链接:https://www.wllwen.com/kejilunwen/jixiegongcheng/2497468.html


Copyright(c)文论论文网All Rights Reserved | 网站地图 |

版权申明:资料由用户1c2b9***提供,本站仅收录摘要或目录,作者需要删除请E-mail邮箱bigeng88@qq.com