有源相控阵天线小通道冷板的热仿真分析与热设计

发布时间：2018-01-05 23:05

本文关键词：有源相控阵天线小通道冷板的热仿真分析与热设计　出处：《电子科技大学》2014年硕士论文　论文类型：学位论文

【摘要】：从20世纪60年代开始,有源相控阵天线由于巨大的技术潜力而受到国内外的普遍重视,并得到大力发展和应用。但是,随着天线的集成度和热功耗不断地增加,天线的高组装密度使得热设计变得尤为重要和突出。天线的热设计与天线的电性能指标直接相关,会影响到天线的探测、跟踪和识别等功能的实现。而有源相控阵天线的热功耗主要集中在T/R组件上,天线阵面可能有几千个T/R组件和几万个功率晶体管,组成了庞大的发热体。因此,如何解决这几千个T/R组件的发热便成了天线热设计最关键的问题。基于此,本文以有源相控阵天线为主要研究对象,对其进行散热需求分析,以单个T/R组件为载体深入研究微小通道散热技术,最后设计出新型冷板以解决天线的散热问题。具体工作包括:(1)研究了T/R组件的热需求和某组件热仿真分析的详细过程。首先分析有源相控阵天线的结构和散热系统,仔细介绍了T/R组件的结构与工作特点。然后对某组件的详细模型进行热仿真分析,并对三种简化建模方法进行研究,最后提出T/R组件的热阻模型并计算,确定T/R组件的冷却任务,提出合理的冷却方式。(2)研究了不同因素对散热器的压降和散热性能的影响,并对小通道散热器进行优化设计。基于传热学和计算流体力学,建立流热耦合数学模型;研究小通道的水力直径、高宽比、孔隙率以及冷却液的入口速度对压降和散热性能的单因素影响。阐述了析因设计和响应面法的基本理论,并基于仿真数据,通过析因设计和响应面优化方法对小通道的多因素参数进行影响因子评估和设计小通道结构参数与流体参数。(3)研究了冷板流道的拓扑形状对冷板的压降和散热性能的影响分析并设计出新型流道冷板。建立有源相控阵天线线阵的冷板模型,分析常规流道的小通道冷板的散热效果;提出仿蜂窝流道的小通道冷板并对其温度场、压力场进行仿真分析,与常规流道的小通道冷板进行对比分析后发现,新型流道冷板更好解决了散热和压降的问题,满足了T/R组件上表面热流密度为95W/cm2的功率晶体管的散热需求。最后将新型流道冷板应用于整个有源相控阵天线系统,并进行热仿真分析。
[Abstract]:Since 1960s, active phased array antenna has been widely paid attention at home and abroad because of its huge technical potential, and has been vigorously developed and applied. With the increasing integration and thermal power consumption of the antenna, the high density of the antenna assembly makes the thermal design more important and prominent. The thermal design of the antenna is directly related to the electrical performance of the antenna. The thermal power consumption of active phased array antenna is mainly focused on the T / R module. The antenna array may have thousands of T / R components and tens of thousands of power transistors that make up a huge heat. How to solve the heating of thousands of T / R components has become the most critical problem in antenna thermal design. Based on this, this paper takes active phased array antenna as the main research object, and analyzes its heat dissipation requirements. Using a single T / R module as the carrier, the micro-channel heat dissipation technology is deeply studied. Finally, a new type of cold plate is designed to solve the heat dissipation problem of the antenna. The thermal requirements of the T / R module and the detailed process of thermal simulation analysis of a component are studied. Firstly, the structure and heat dissipation system of the active phased array antenna are analyzed. The structure and working characteristics of the T / R component are introduced in detail. Then the detailed model of a component is analyzed by thermal simulation and three simplified modeling methods are studied. Finally, the thermal resistance model of the T / R module is put forward and calculated, the cooling task of the T / R module is determined, and the reasonable cooling mode is put forward. (2) the influence of different factors on the pressure drop and heat dissipation performance of the radiator is studied. Based on heat transfer and computational fluid dynamics, the mathematical model of fluid-heat coupling is established. The single factor influence of hydraulic diameter, aspect ratio, porosity and inlet velocity of coolant on pressure drop and heat dissipation performance of small passage is studied. The basic theory of factorial design and response surface method is expounded and based on simulation data. Through factorial design and response surface optimization method, the influence factors of multi-factor parameters of small channel are evaluated and the structural parameters and fluid parameters of small passage are designed. The influence of the topology of the cold plate runner on the pressure drop and heat dissipation performance of the cold plate was studied and a new type of cold plate was designed. The cold plate model of the active phased array antenna linear array was established. The heat dissipation effect of the small channel cold plate of the conventional flow channel is analyzed. The simulation analysis of the temperature field and pressure field of the small channel cold plate is presented, and the results are compared with those of the conventional channel cold plate. The new runner cooling plate solves the problems of heat dissipation and pressure drop better. The heat dissipation requirement of the power transistor with heat flux of 95 W / cm 2 on the surface of the T / R module is satisfied. Finally, a new type of flow channel cold plate is applied to the whole active phased array antenna system, and the thermal simulation is carried out.
【学位授予单位】：电子科技大学
【学位级别】：硕士
【学位授予年份】：2014
【分类号】：TN821.8

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