基于MCM的SAR数据处理模块关键技术研究

发布时间：2018-02-10 07:34

本文关键词： 合成孔径雷达多芯片组件低温共烧陶瓷信号完整性　出处：《西安电子科技大学》2014年硕士论文　论文类型：学位论文

【摘要】：合成孔径雷达具有全天候侦查能力,是一种重要的侦查测量手段,很多领域都对合成孔径雷达有明确的需求。近年来,设备小型化技术得到了充足的发展,在技术上已经可以做到合成孔径雷达的小型化,以方便合成孔径雷达安装在小型载具上使用。实现合成孔径雷达小型化的关键技术有多芯片组件技术和LTCC技术。多芯片组件技术是一种组装效率较高的微电子组装技术,它将大量电子元器件组装在面积较小的高密度互连基板上。基板的设计是多芯片组件设计的关键。低温共烧陶瓷基板有烧结温度低、烧结收缩率稳定、介质材料介电常数小绝缘性好、导体电阻率小、层叠数目不受限制等优良特性。低温共烧陶瓷基板的这些优点极大地方便了基板的设计。多芯片组件将大量的电子元器件组装在面积还很小的基板上,致使电子元器件间距很小,布线密度很大,必然会导致信号完整性问题的出现。因此有必要对多芯片组件进行信号完整性仿真,并以仿真结果指导多芯片组件的设计。本文主要研究了基板内部过孔对信号完整性的影响。首先,本文为过孔建立了电气模型,该模型是一个π形电路,包括一个寄生电容和两个寄生电感。然后本文通过对该模型进行仿真研究了当过孔位于信号线末端和信号线中间两种情况下过孔对信号完整性的影响。仿真结果表明,过孔对信号完整性的影响随寄生电容和寄生电感的增大而增大;当过孔位于信号线中间时对信号完整性的影响要大于位于末端的情况。因此在设计多芯片组件时尽量选用寄生效应的过孔并减少使用数量。在考虑信号完整性的前提下,本文以合成孔径雷达的小型化为出发点,研究了使用多芯片组件技术对合成孔径雷达的数据处理模块进行重新设计和实现的问题。首先,对原有的数据处理模块进行重组以满足三维多芯片组件的结构要求。原数据处理模块被设计成三维多芯片组件的结构,由封装保护外壳、顶层二维多芯片组件、底层二维多芯片组件和垂直互连部件四大部分组成。然后使用Cadence软件为重组的数据处理模块建立符号库、封装库、设计原理图、设计版图并导出生产数据,生产数据主要包括钻孔数据文件和光绘数据文件。最后根据导出的生产数据采用低温共烧陶瓷技术经过实现三维多芯片组件数据处理模块。
[Abstract]:Synthetic Aperture Radar (SAR) has the ability of all-weather investigation and is an important means of investigation and measurement. In many fields, synthetic Aperture Radar (SAR) has a clear demand. In recent years, the miniaturization technology of equipment has been fully developed. Technically, it has been possible to miniaturize synthetic aperture radar, The key technologies to realize the miniaturization of synthetic Aperture Radar are multi-chip module technology and LTCC technology. Multi-chip module technology is a kind of micro-electronic assembly technology with high assembly efficiency. A large number of electronic components are assembled on a high-density interconnect substrate with small area. The design of the substrate is the key to the design of multi-chip modules. The low temperature co-fired ceramic substrate has low sintering temperature and stable sintering shrinkage. The dielectric constant is small and the dielectric constant is good, and the resistivity of the conductor is small. The advantages of low temperature co-fired ceramic substrates greatly facilitate the design of substrates. Multichip modules assemble a large number of electronic components on substrates with very small area. It is necessary to simulate the signal integrity of multi-chip modules because the distance between electronic components is very small and the wiring density is very high, which will inevitably lead to the problem of signal integrity. And the simulation results are used to guide the design of multi-chip components. This paper mainly studies the influence of the internal perforation on the signal integrity. Firstly, an electrical model is established for the perforation, which is a 蟺-shaped circuit. It includes a parasitic capacitance and two parasitic inductors. Then, the effect of the perforation on the signal integrity is studied by the simulation of the model when the hole is located at the end of the signal line and in the middle of the signal line. The effect of perforation on signal integrity increases with the increase of parasitic capacitance and inductance. When the hole is in the middle of the signal line, the effect on the signal integrity is greater than that at the end. Therefore, when designing the multichip module, the parasitic effect is chosen as much as possible and the number of using is reduced. Based on the miniaturization of synthetic Aperture Radar (SAR), this paper studies the redesign and implementation of SAR data processing module using multi-chip module technology. The original data processing module is reorganized to meet the structural requirements of the 3D multi-chip module. The original data processing module is designed into the structure of the three-dimensional multi-chip module, which is encapsulated and protected by the shell, and the top layer of the two-dimensional multi-chip module. There are four parts of the bottom 2-D multi-chip component and vertical interconnect component. Then Cadence software is used to set up symbol library, encapsulate library, design principle diagram, design layout and export production data for the reorganized data processing module. The production data mainly include borehole data file and light drawing data file. Finally, the data processing module of 3D multi-chip module is realized by using low-temperature co-fired ceramic technology according to the exported production data.
【学位授予单位】：西安电子科技大学
【学位级别】：硕士
【学位授予年份】：2014
【分类号】：TN957.52

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