基于物联网RFID技术的太极半导体生产管理研究

发布时间：2018-03-11 14:19

本文选题：物联网　切入点：RFID　出处：《南京大学》2014年硕士论文　论文类型：学位论文

【摘要】：物联网是把物理对象无缝集成到信息网络,方便管理和识别的一种智能网络,其中射频识别电子标签(RFID),是物联网中各种技术之中的重要一种。近十年来,物联网发展非常迅猛,各种技术不断完善和成熟,其应用成本也在不断的降低。现在物联网已经被广泛的应用于各个领域,如交通、环保节能、政府机构、工业监督、全球安防、家居安全、食品安全、医疗保健等等,以提高产品质量,改进生产管理效率。半导体是近半个世纪以来,全球发展迅猛的产业之一,半导体芯片的集成度的不断提高,产品逐步向小批量,多品种转换。半导体制造又是一个资金高度密集、流程高度复杂的加工过程,半导体的封装测试过程中长期存在着用错设备、用错工具、用错材料、产品混批等问题,这些问题成为半导体封测生产管理的瓶颈。太极半导体(苏州)有限公司就是属于半导体封装测试行业的一个外包加工企业,他是由无锡太极实业有限公司在2012年12月从意大利独资的新义半导体(苏州)有限公司收购过来,以实现太极实业由纺织和纺织机械行业向半导体行业扩展的战略。新义半导体(苏州)有限公司成立于2005年,是意大利EEMS集团(原TI意大利)由于竞争和成本压力,将半导体封测工厂迁移到苏州。本文认为,利用目前太极半导体已经具有的复杂而且功能强大的信息系统,引进物联网的RFID技术的应用,将生产管理系统扩展到对生产机器进行合理的控制,能够从根本上解决用错设备、用错工具、用错材料、产品混批等问题,从而大大减少半导体封装测试的不良率,提高产品的质量,进一步降低企业的运营成本,增强企业的竞争力。本文通过对物联网的历史和发展的介绍,以及物联网技术和应用的分析,提出将物联网RFID的应用引入到太极半导体的理念。再通过对太极半导体封装测试的工艺流程的分析,引出太极半导体封装测试过程中所面临的生产管理的瓶颈问题。通过对问题的根源分析,大胆提出将物联网RFID引入半导体封装测试实现智能化生产管理的解决方案,并详细阐述如何将物联网RFID导入实现与生产管理系统完美结合以实现对生产机器的合理管控。最后,本文对物联网RFID导入的成本,效益,竞争优势等方面作综合的分析,阐述物联网RFID如何有效地弥补当前太极半导体的管理中的不足之处,以加强说明引入物联网RFID的必要性。本文相信,物联网技术在太极半导体公司管理的各个方面深入应用,而且物联网的应用将会被其他的半导体封装测试企业所采用,以至于整个半导体封装测试行业,随着技术的成熟和应用成本的逐步降低,物联网的应用可以逐步从高利润制造行业向薄利润制造行业的应用扩展,从根本上提高制造业的生产管理效率、提高产品质量,进而提高我们的生活水平。
[Abstract]:The Internet of things (IOT) is an intelligent network that integrates physical objects seamlessly into the information network, which is convenient to manage and identify. Among them, RFID tag is one of the most important technologies in the Internet of things. In the last decade, the Internet of things has developed very rapidly. The Internet of things has been widely used in various fields, such as transportation, environmental protection and energy saving, government agencies, industrial supervision, global security, home safety. Food safety, medical care, and so on, to improve product quality and improve production management efficiency. Semiconductor is one of the rapidly developing industries in the world in the past half century. Semiconductor manufacturing is also a highly capital-intensive, highly complex process, semiconductor packaging testing process has long existed in the wrong equipment, using the wrong tools, using the wrong materials, product batch, and so on. These problems have become the bottleneck of semiconductor closed test production management. Taiji Semiconductor (Suzhou) Co., Ltd. is an outsourcing processing enterprise in the semiconductor packaging testing industry. He was acquired in December 2012 by Wuxi Taiji Industrial Co., Ltd. from Xinyi Semiconductor (Suzhou) Co., Ltd, which is wholly owned by Italy. Xinyi Semiconductor (Suzhou) Co., Ltd. was established in 2005, is the Italian EEMS Group (formerly TI Italy) due to competition and cost pressure, This paper holds that the application of RFID technology in the Internet of things can be introduced by using the complex and powerful information system that Taiji Semiconductor already has. By extending the production management system to the reasonable control of the production machine, the problems of using the wrong equipment, using the wrong tools, using the wrong materials, using the wrong batches, etc. can be fundamentally solved, thus greatly reducing the defective rate of the semiconductor packaging test. This paper introduces the history and development of the Internet of things, and analyzes the technology and application of the Internet of things. The idea of introducing the application of Internet of things (RFID) into Taiji semiconductor is put forward. This paper introduces the bottleneck of production management in the process of Taiji semiconductor packaging testing. By analyzing the root of the problem, the solution of intelligent production management by introducing the Internet of things (RFID) into semiconductor packaging testing is put forward. And how to combine the implementation of the Internet of things RFID with the production management system in order to realize the reasonable control of the production machine. Finally, this paper makes a comprehensive analysis on the cost, benefit and competitive advantage of the introduction of the Internet of things RFID. This paper describes how the Internet of things (RFID) can effectively remedy the deficiencies in the current management of Taiji Semiconductor, so as to strengthen the necessity of introducing the Internet of things (RFID). This paper believes that the Internet of things technology has been applied in every aspect of Taiji Semiconductor Company's management. And the application of the Internet of things will be adopted by other semiconductor packaging testing enterprises, so that the whole semiconductor packaging testing industry, as technology matures and application costs gradually reduce, The application of the Internet of things can gradually expand from the high-profit manufacturing industry to the low-profit manufacturing industry, and fundamentally improve the production management efficiency and product quality of the manufacturing industry, and then improve our living standard.
【学位授予单位】：南京大学
【学位级别】：硕士
【学位授予年份】：2014
【分类号】：TP391.44;TN929.5;F426.63

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