方正公司高频微波电路板开发与生产管理研究
发布时间:2018-06-22 23:59
本文选题:高频微波电路板 + 项目管理 ; 参考:《华中科技大学》2014年硕士论文
【摘要】:高频微波电路板对电路板制造商来说非常关键。国家对TD-LTE (3G4G)网络的大规模部署和发展战略,必将促使3G4G建网过程及未来升级改造需要大量的网络设备,这将刺激我国设备制造企业研发更先进的设备。因此,高频高速电路板必将成为未来新型电子产品的设计与制造领域一个新的技术制高点和产业生长点,具有十分巨大的市场开发潜力。高频微波电路板是一系列的新产品,目前在国内仍处于起步阶段,方正PCB公司希望在这类新型的高端电路板发展上抢占先机。面对这个千载难逢的机遇,如何使高频微波电路板技术开发成功并且迅速实现批量生产和产业化,是新时期的方正的一项重大新课题。 传统的研发模式已经不能够满足技术和市场的变化速度,而项目管理在信息经济的企业管理中应用越来越普及。国内外的项目管理实践证明,项目管理理论和方法可以运用在新产品开发管理上,但遗憾的是目前以项目形式进行的项目管理成功率并不高。本文以高频微波电路板开发和生产管理实践为例,研究了现状问题、管理方案和管理方法等三个方面。首先,系统分析了公司的高频微波电路板开发管理现状和问题,并应用项目管理方法来解决公司的问题。其次,建立目标导向的项目管理模型和模式化流程,从而完成开发项目管理方案。最后,,分析项目管理的成功要素后,确定生产制造管理的核心是生产进度、产品质量和制造成本,并提出相应的管理方法;介绍了项目实施的信息沟通、项目评价和团队激励等方面的管理办法。同时要强调的是:技术开发要用好FMEA和DOE,以项目生命周期为基础来构建模式化流程,帕累托图和FMEA有助于改善生产过程的质量,沟通渠道有助于理顺沟通关系,合理应用变更管理流程。此外,希望高频微波电路板的开发管理模式能够对PCB行业的新产品开发管理提供一些借鉴。
[Abstract]:High frequency microwave circuit board is very important to circuit board manufacturer. The large-scale deployment and development strategy of TD-LTE (3G4G) network will promote the process of 3G4G network construction and the upgrading and transformation of 3G4G network in the future, which will stimulate our equipment manufacturing enterprises to develop more advanced equipment. Therefore, high frequency and high speed circuit board will become a new technology commanding point and industrial growth point in the field of design and manufacture of new electronic products in the future. High frequency microwave circuit board is a series of new products. At present, it is still in the initial stage in China. Fangzheng PCB Company hopes to take the lead in the development of this kind of new high-end circuit board. In the face of this once-in-a-lifetime opportunity, how to make the technology of high frequency microwave circuit board develop successfully and realize batch production and industrialization rapidly is an important new subject in the new era. The traditional R & D mode can not meet the changing speed of technology and market, and the application of project management in the enterprise management of information economy is becoming more and more popular. The practice of project management at home and abroad proves that the theory and method of project management can be applied to the management of new product development, but unfortunately, the success rate of project management in the form of project is not high. Taking the development and production management practice of high frequency microwave circuit board as an example, this paper studies three aspects: current situation, management scheme and management method. Firstly, the current situation and problems of the development and management of high frequency microwave circuit board are systematically analyzed, and the project management method is applied to solve the problems of the company. Secondly, the goal-oriented project management model and pattern flow are established to complete the project management scheme. Finally, after analyzing the successful elements of project management, the core of production manufacturing management is determined to be production schedule, product quality and manufacturing cost, and the corresponding management methods are put forward, and the information communication of project implementation is introduced. Management of project evaluation and team motivation. At the same time, it should be emphasized that technology development should make good use of FMEA and doe, build model process based on project life cycle, Pareto chart and FMEA help to improve the quality of production process, and communication channel can help to straighten out the communication relationship. Reasonable application of change management process. In addition, it is hoped that the development and management mode of high frequency microwave circuit board can provide some reference for the new product development and management of PCB industry.
【学位授予单位】:华中科技大学
【学位级别】:硕士
【学位授予年份】:2014
【分类号】:TN929.5
【相似文献】
相关期刊论文 前5条
1 周保民;张建国;;基于多普勒效应的超高频微波智能安防系统[J];电子世界;2013年09期
2 ;使用手机的七大误区[J];工会博览;2013年08期
3 郭峰,徐柏华;高频微波PCB基材[J];印制电路信息;2001年11期
4 何秋阳;三维单片高频微波集成电路的封装技术[J];微电子技术;2002年06期
5 ;[J];;年期
相关会议论文 前1条
1 曾红;肖璐;董浩彬;;高精度高频微波线制作研究[A];2011中国电子制造与封装技术年会论文集[C];2011年
相关重要报纸文章 前1条
1 南京市妇幼保健院腔镜科主任 王素敏邋孔晓明 杨丽佳 整理;月经过多可用高频微波治疗[N];健康报;2008年
相关硕士学位论文 前2条
1 袁为群;方正公司高频微波电路板开发与生产管理研究[D];华中科技大学;2014年
2 谢万松;基于光学方式形成高频微波[D];华中科技大学;2007年
本文编号:2054800
本文链接:https://www.wllwen.com/kejilunwen/wltx/2054800.html